1-51
HXC-100/V2 (J, E)
------------
PA-353 BOARD
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Ref. No.
or Q’ty Part No. SP Description
C1 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C2 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C3 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C4 1-100-816-21 s CAP, ELECT 33MF (5.6X6.5)
C5 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C6 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C7 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C8 1-100-816-21 s CAP, ELECT 33MF (5.6X6.5)
C9 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C10 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C11 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C12 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C15 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C16 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C17 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225)
C18 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225)
C19 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225)
C20 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225)
C21 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C22 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C23 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C24 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C25 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C26 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C27 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C28 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C29 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C30 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C31 1-135-349-21 s CAP, ELECT 22MF (6.3X6)
C32 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C33 1-164-840-81 s CAP, CHIP CERAMIC 1PF CK 1005
C34 1-164-840-81 s CAP, CHIP CERAMIC 1PF CK 1005
C35 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C36 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C37 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C38 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C39 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C40 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C41 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C42 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C45 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C46 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C47 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C48 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C49 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C50 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C51 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C52 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C53 1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C54 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C55 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C56 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C57 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C58 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C59 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C60 1-164-845-81 s CAP, CHIP CERAMIC 5PF CH 1005
C61 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C62 1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C63 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
(PA-353 BOARD)
Ref. No.
or Q’ty Part No. SP Description
C64 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C65 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C66 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C67 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C68 1-165-989-91 s CAP, CERAMIC 10MF (2012)
CN1 1-778-652-31 s CONNECTOR, FFC (ZIF) 50P
D1 8-719-056-48 s DIODE 1SS388(TPL3)
D2 8-719-056-48 s DIODE 1SS388(TPL3)
D3 8-719-989-04 s DIODE DAN222-TL
D4 8-719-989-04 s DIODE DAN222-TL
D5 8-719-210-46 s DIODE EC10QS-06-TE12L
FB1 1-469-122-21 s FERRITE, EMI (SMD) (1608)
FB2 1-469-122-21 s FERRITE, EMI (SMD) (1608)
FB3 1-400-334-21 s FERRITE, EMI (SMD) (1608)
FB4 1-400-334-21 s FERRITE, EMI (SMD) (1608)
FB5 1-469-122-21 s FERRITE, EMI (SMD) (1608)
IC3 6-706-863-01 s IC LMH6732MFX/NOPB
IC4 6-706-863-01 s IC LMH6732MFX/NOPB
IC5 8-753-240-64 s IC CXA3647CR-T4
IC6 8-759-346-27 s IC LM45BIM3X
Q1 8-729-809-73 s TRANSISTOR 2SK536-TB
R3 1-244-161-81 s RES, CHIP 2.2 (1005)
R4 1-244-161-81 s RES, CHIP 2.2 (1005)
R5 1-208-935-81 s RES, CHIP 100K (1005)
R6 1-218-990-81 s CONDUCTOR, CHIP (1005)
R7 1-218-990-81 s CONDUCTOR, CHIP (1005)
R8 1-208-911-81 s RES, CHIP 10K (1005)
R9 1-208-911-81 s RES, CHIP 10K (1005)
R10 1-208-895-81 s RES, CHIP 2.2K (1005)
R11 1-208-903-81 s RES, CHIP 4.7K (1005)
R12 1-208-919-81 s RES, CHIP 22K (1005)
R13 1-208-911-81 s RES, CHIP 10K (1005)
R14 1-208-895-81 s RES, CHIP 2.2K (1005)
R15 1-208-935-81 s RES, CHIP 100K (1005)
R16 1-208-935-81 s RES, CHIP 100K (1005)
R17 1-208-959-81 s RES, CHIP 1M (1005)
R18 1-208-863-81 s RES, CHIP 100 (1005)
R19 1-218-990-81 s CONDUCTOR, CHIP (1005)
R20 1-208-959-81 s RES, CHIP 1M (1005)
R21 1-208-855-81 s RES, CHIP 47 (1005)
R22 1-218-990-81 s CONDUCTOR, CHIP (1005)
R23 1-218-990-81 s CONDUCTOR, CHIP (1005)
R24 1-208-875-81 s RES, CHIP 330 (1005)
R27 1-208-875-81 s RES, CHIP 330 (1005)
R30 1-208-919-81 s RES, CHIP 22K (1005)
R31 1-208-903-81 s RES, CHIP 4.7K (1005)
R32 1-208-919-81 s RES, CHIP 22K (1005)
R33 1-208-887-81 s RES, CHIP 1.0K (1005)
R34 1-208-919-81 s RES, CHIP 22K (1005)
R35 1-220-878-81 s RES, CHIP 22 (1005)
R36 1-220-878-81 s RES, CHIP 22 (1005)
R37 1-208-931-81 s RES, CHIP 68K (1005)
R38 1-208-931-81 s RES, CHIP 68K (1005)
R39 1-208-863-81 s RES, CHIP 100 (1005)
R40 1-208-863-81 s RES, CHIP 100 (1005)
R41 1-208-887-81 s RES, CHIP 1.0K (1005)
R42 1-208-887-81 s RES, CHIP 1.0K (1005)
Содержание HXC-100
Страница 1: ...HD COLOR CAMERA HXC 100 SERVICE MANUAL Volume 2 1st Edition ...
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Страница 206: ...Sony Corporation HXC 100 UC HXC 100 J HXC 100 CE J E 9 968 627 01 Printed in Japan 2009 4 08 2009 ...