Softing Data Flow commModule MBP, Руководство по оборудованию

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commModule MBP - Hardware Manual
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© Softing Industrial Automation GmbH
Note
It is recommended to include 4 vias on the host PCB near the corners (not in keep out area) to
avoid tilting of the CommModule MBP during soldering.
Intrinsic safety :
1. Ensure there is no copper within 0.5mm of the marked Keep Out Area on the host PCB.
2. Ensure a clearance of 2mm between signals on Pin 40 – 43 to all other pins.
3. Ensure a clearance of 2mm between fieldbus on Pin 37 – 39 to all other pins and Pin 37 to Pin 39.
Solderpaste
Note
The recommended stencil thickness is 0.12 to 0.15mm.
Note
The schematic library and PCB library for the Altium Designer can be download here :