Chapter 6 - Mechanical specification
© Softing Industrial Automation GmbH
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6.2
Host PCB layout
Recommended footprint
The PCB footprint dimensions may be modified based on user experience and/or process capability.
Routing under the CommModule MBP
Note
The host PCB footprint must not contain any exposed copper under the module except the
pads interfacing the CommModule MBP to avoid any contact with traces on the module.
Содержание Data Flow commModule MBP
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