Name
Function
Method
1
Top heater
Soldering or
de-soldering BGA
Up and down to the
desired position
2
BGA angle adjust
BGA and PCB board
position
Adjust forth and
back
3
Top heater nozzle
Ensure hot air
concentration on BGA
surface
Blow to desired
position from BGA
4
Optical alignment box BGA and PCB board
position
90 degree rotate,
pull out when
positioning, push
back after finished
position
5
Light
Lighting
Adjust light position
6
CCD camera system
Pick up the image of
aligning, de-soldering
and soldering
Switch the control
button and place it
properly.
7
PCB support fixture
Fixed PCB position from
left to right position
Clockwise,
anticlockwise
rotation
8
PCB board micro
adjust X-axis
BGA and PCB board
when the X-axis
direction of the bit of
fine adjustment
PCB to the left
rotating clockwise,
counter clockwise
9
Emergency stop
button
Abnormal or special
equipment when
emergency stop
Press to stop,
Clockwise rotation
10
Light button
Lighting control
Press
11
CCD control switch
Screen image change
Switch over
AV1 shows optical
alignment image
AV2 shows camera
image
12
Start button
Starting control
Press
13
PCB board micro
adjust Y-axis
BGA and PCB board
when the Y-axis
direction of the bit of
fine adjustment
PCB backward spin
clockwise, counter
clockwise
14
Touch screen
Equipment operation
control
Hand touch-screen
15
Joy stick
Rise and fall on the
heater up and down the
left and right to zoom
Shaking the handle
up and down
16
Sensors
Measure the actual
Connect an external
Содержание ACHI-HR15000
Страница 1: ...ACHI HR15000 Rework Station NO ACHI HR 15000 Instruction Manual Shenzhen Scotle Technology Co Ltd...
Страница 6: ...4 Introduction of the main structure...
Страница 24: ...The vacuum pen is sucking the chip Laser position the red light point in the center of chip...
Страница 25: ...Optical alignment Machine testing for customers...
Страница 26: ......