December 2008
General Information
DDR3 SDRAM
3
:
DIMM
4
:
SODIMM
Z FBGA(Lead-free)
H FBGA(Lead-free & Halogen-free)
J FBGA(Lead-free, DDP)
M FBGA(Lead-free & Halogen-free, DDP)
32
:
32M 33
:
32M (for 128Mb/512Mb)
64
:
64M 65
:
64M (for 128Mb/512Mb)
28
:
128M 29
:
128M (for 128Mb/512Mb)
56
:
256M 57
:
256M (for 512Mb/2Gb)
51
:
512M 52
:
512M (for 512Mb/2Gb)
1G
:
1G
1K
:
1G (for 2Gb)
2G
:
2G
2K
:
2G (for 2Gb)
M
1st Gen. A
2nd Gen.
B 3rd Gen. C 4th Gen.
D
5th Gen. E
6th Gen.
F
:
7th Gen. G
8th Gen.
0
:
None
2
:
2nd Rev.
4
:
4th Rev.
B
:
DDR3 SDRAM (1.5V VDD)
1. Memory Module : M
2. DIMM Type
3. Data Bits
4. DRAM Component Type
5. Depth
12. Speed
11. Temp & Power
10. PCB Revision
9. Package
8. Component Revision
7
:
8Banks & SSTL-1.5V
6. # of Banks in comp. & Interface
3. DDR3 SDRAM Module Ordering Information
:
:
:
:
:
:
:
:
:
:
:
1
:
1st Rev.
3
:
3rd Rev.
C
L
Y
:
Commercial Temp.( 0
°
C ~ 85
°
C) & Normal Power
:
Commercial Temp.( 0
°
C ~ 85
°
C) & Low Power
:
Commercial Temp.( 0
°
C ~ 85
°
C) & Low VDD(1.35V)
Note: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
PCB Revision
Component Revision
# of Banks in Comp. & Interface
Depth
DRAM Component Type
Data bits
DIMM Type
Memory Module
Package
Temp & Power
Speed
M X X X B X X X X X X X - X X X
1 2 3 4 5 6 7 8 9 10 11 12
Bit Organization
0
:
x 4
3
:
x 8
4
:
x16
7. Bit Organization
:
DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
:
DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
:
DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
:
DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
F7
F8
H9
K0
71
: x64 204pin Unbuffered SODIMM
78
: x64 240pin Unbuffered DIMM
91
: x72 240pin ECC unbuffered DIMM
92
: x72 240pin VLP Registered DIMM
93
: x72 240pin Registered DIMM
