Samsung DDR3, Руководство по эксплуатации продукта, Страница: 9 / 15

December 2008
General Information DDR3 SDRAM
78 Ball FBGA for 1Gb E-die (x4/x8)
96 Ball FBGA for 1Gb E-die (x16)
A
B
C
D
E
F
G
H
M
N
7.50
±
0.10
0.
80 x
12
=
9.
60
0.80 x 8 = 6.40
3.20 0.80
4.
80
78 -
∅
0.45 Solder ball
0.2 A B M
(Datum B)
(Datum A)
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
11
.0
0
±
0.
10
J
K
L 0.
80
0.
80
(Post Reflow
∅
0.05
±
0.05)
(0.95)
(1.90)
Bottom
Top
Bottom
Top
#A1 7.50
±
0.10
1
1
.00
±
0.
10
0.
10
MA
X
0.
50
±
0.
05
1.10
±
0.10
0.35
±
0.05
A
B
C
D
E
F
G
H
J
L
M
N
P
R
T
7.50
±
0.10
6.
00
(Datum B)
(Datum A)
#A1 INDEX MARK
13.
30
±
0.1
0
K
0.
80 x
15 =
1
2
.0
0
B
A
0.
80
0.
40
96 -
∅
0.45 Solder ball
0.2 A B M
MOLDING AREA
(Post Reflow
∅
0.05
±
0.05)
(0.95)
(1.90)
#A1
7.50
±
0.10
13
.3
0
±
0.
10
0.
1
0
M
A
X
0.
50
±
0.
05
1.10
±
0.10
0.35
±
0.05
8 7 6 5 4 3 2 1 9
0.80 x 8 = 6.40
3.20 0.80 1.60
8 7 6 5 4 3 2 1 9