Samsung DDR3, Руководство по эксплуатации продукта

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December 2008
General Information DDR3 SDRAM
78 + 4Ball FBGA for 1Gb D-die (x4/x8)
96 + 4Ball FBGA for 1Gb D-die (x16)
A
B
C
D
E
F
G
H
M
N
9.00
±
0.10
0.
80 x
12
=
9.
60
0.80 x 10 = 8.00
4.00 0.80
4.
80
82 -
∅
0.45 Solder ball
0.2 A B M
(Datum B)
(Datum A)
10 8 7 6 5 4 3 2 1 11 9
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
11
.0
0
±
0.
10
J
K
L 0.
80
0.
80
(Post Reflow
∅
0.05
±
0.05)
(0.95)
(1.90)
Bottom
Top
Bottom
Top
#A1 9.00
±
0.10
11
.0
0
±
0.
10
0.
10
MA
X
0.
50
±
0.
05
1.10
±
0.10
0.35
±
0.05
A
B
C
D
E
F
G
H
J
L
M
N
P
R
T
9.00
±
0.10
4.00 0.80
6.
00
(Datum B)
(Datum A)
10 8 7 6 5 4 3 2 1 11 9
1.60
#A1 INDEX MARK
13.
30
±
0.1
0
K
0.
80 x
15 =
1
2
.0
0
0.80 x 10 = 8.00
B
A
0.
80
0.
40
100 -
∅
0.45 Solder ball
0.2 A B M
MOLDING AREA
(Post Reflow
∅
0.05
±
0.05)
(0.95)
(1.90)
#A1
9.00
±
0.10
13
.3
0
±
0.
10
0.
1
0
M
A
X
0.
50
±
0.
05
1.10
±
0.10
0.35
±
0.05
: Support Ball
: Support Ball