Samsung DDR3, Руководство по эксплуатации продукта

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December 2008
General Information DDR3 SDRAM
78Ball FBGA for 2Gb B-die (x4/x8)
96Ball FBGA for 2Gb B-die (x16)
A
B
C
D
E
F
G
H
M
N
9.00
±
0.10
0.
80 x
12
=
9.
60
3.60 0.80
4.
80
78 -
∅
0.45 Solder ball
0.2 A B M
(Datum B)
(Datum A)
1.60
MOLDING AREA
#A1 INDEX MARK
B
A
BOTTOM VIEW
11
.5
0
±
0.
10
J
K
L
0.
80
0.
80
(Post Reflow
∅
0.50
±
0.05)
(0.95)
(1.90)
0.
10MAX
1.10
±
0.10
#A1 9.00
±
0.10
11
.5
0
±
0.
10
0.35
±
0.05
TOP VIEW
A
B
C
D
E
F
G
H
J
L
M
N
P
R
T
9.00
±
0.10
3.60 0.80
6.
0
0
(Datum B)
(Datum A)
1.60
#A1 INDEX MARK
1
3
.30
±
0.
10
K
0.
80
x
1
2
=
12.
00
B
A
0.
80
0.
4
0
96 -
∅
0.45 Solder ball
0.2 A B M
MOLDING AREA
(Post Reflow
∅
0.50
±
0.05)
(0.95)
(1.90)
BOTTOM VIEW
0.1
0
MAX
1.10
±
0.10
#A1
9.00
±
0.10
1
3
.30
±
0.
10
0.35
±
0.05
TOP VIEW
8 7 6 5 4 3 2 1 9
8 7 6 5 4 3 2 1 9