December 2008
General Information
DDR3 SDRAM
1. DDR3 SDRAM Component Ordering Information
51
:
512Mb
1G
:
1Gb
2G
:
2Gb
4G
:
4Gb
04
:
x 4
08
:
x 8
16
:
x16
3
:
4 Banks
4
:
8 Banks
5
:
16 Banks
3. DRAM Type
4. Density
5. Bit Organization
6. # of Internal Banks
M
A
B
C
D
E
F
G
H
Z
H
J
M
C
L
Y
9. Package Type
8. Revision
10. Temp & Power
1. SAMSUNG Memory : K
2. DRAM : 4
Revision
# of Internal Banks
Bit Organization
Density
DRAM Type
DRAM
SAMSUNG Memory
Interface (V
DD
, V
DDQ
)
Package Type
Temp & Power
1 2 3 4 5 6 7 8 9 10 11
Speed
B
:
DDR3 SDRAM
:
Commercial Temp.( 0
°
C ~ 85
°
C) & Normal Power
:
Commercial Temp.( 0
°
C ~ 85
°
C) & Low Power
:
Commercial Temp.( 0
°
C ~ 85
°
C) & Low VDD(1.35V)
:
FBGA (Lead-free)
:
FBGA (Halogen-free & Lead-free)
:
FBGA (Lead-free, DDP)
:
FBGA (Halogen-free & Lead-free, DDP)
:
1st Gen.
:
2nd Gen.
:
3rd Gen.
:
4th Gen.
:
5th Gen.
:
6th Gen.
:
7th Gen
:
8th Gen
:
9th Gen
11. Speed
K 4 B X X X X X X X - X X X X
:
DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
:
DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
:
DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
:
DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
F7
F8
H9
K0
6
:
SSTL (1.5V, 1.5V)
7. Interface ( V
DD
, V
DDQ
)
