S
Proc Sheet 1 12
myX-6/myV-65
ELECTRONIC BOARD EXCHANGE
1/3
Ref. SCT U38 SSC DTS 0012 – Index A - May 12 , 2003
Page 5-37
Preliminary operation
1. Control of the IMEI label integrity
2. Remove the electronic board (Proc sheet 1 04)
3. Control of any oxidation marks (on the electronic board and under the metal dome)
Return procedure :
(a) The electronic boards are packaged in individual electrostatic envelopes
. They must be stocked in their
original package of reception , to insure a good protection against external attacks (see enclosed photos)
(b)
During the electronic boards manipulation , gloves and electrostatic strap must be worn at all times.
(c)
The defective electronic boards have to be returned to SAGEM factory, packaged individually, in the
original package (see enclosed photos) , in the appropriate ESD box : One box per Sagem reference
(check reference written on the box).
(d)
The defective board should display the defect code written on a sticker (placed on the shielding) and
have the label provided with OMM on each ESD bag .
Note :
-
On the defective boards , it is necessary to check visually under the metal dome to
discover if it shows oxidation marks. The defective boards should be returned with
their original metal dome
-
Boards with oxidation should not to set in conformance with the warranty
-
The defective boards must never be mixed with the complete mobiles
Placement procedure :
1. Exchange the defective board with a functional board of the same Sagem reference (25M).
Further operations :
1. Place the new electronic board on the assembly plate. .(
Proc sheet 1 04
)
2. Replace the customer housing (Proc Sheet 0 03 et 1 01)
3. Follow stages ( see enclosed photos) and the OMM instructions
(Proc sheet 01)
