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BGA2015 OPERATION MANUAL                                                                                                                       

 

Page10 

 

After finishing modifying working mode, if you want to modify laser alignment mode, operate 
as D item shows; if no need to modify it, please press DOWN key to browse the next

 

parameter 

settings. 

 

C-1. Modify Parameter of working flow 

If it is necessary to modify parameter of a working flow, first you must select the working flow 
and then modify its parameter. 
                     
The  soldering  technics  is  decided  by  T0,  TB,  T1,  T2,  T3,  S1,  S2  and  S3.  It  describes  the 
temperature  graph  during  the  system  working.  TL  denotes  Melting  temperature  of  solder  and 
the range between T2 and T3. 
 
T0                                                                                                                                                                             
T0 is the valve temperature for bottom heater required by top heater when it heats up. Also it is 
the  first  temperature  of  this  technics  process.  When  the  work  flow  begins,  the  bottom  heater 
starts to heat up. After reaching the T0, the top heater begins to heat up. 
 
TB

Tb

TC                                                                                                                                                                               

TB:  The  test  temperature  of  bottom  preheating  Tb:  set  temperature  of  bottom  heating  TC: 
Real-time temperature of top heating   
 
T1                                                                                                                                                                                 
It is the heat preservation starting temperature of reflow soldering. It is the second temperature 
of this technics process. The temperature rises to T1 with a proper speed the component permits. 
In parameter modifying, use the UP and DOWN knob to set the value of T1. 
 
T2                                                                                                                                                                               
It  is  the  temperature  when  finish  the  heat  preservation  of  reflow  soldering.  The  pre-heating 
temperature  rises  to  T2,  after  the  time  of  S1  finishes.  Within  this  time,  PCB  and  component 
pre-heating  is  finished  and  the  solder  is  activated.  In  parameter  modifying,  use  the  UP  and 
DOWN key to set the value of T2. 
 
T3                                                                                                                                                                             
It  is  the  peak  value  temperature  of  reflow  soldering.  When  the  temperature  reaches  T2,  the 
temperature equably rises to T3 with a definite raising speed. The soldering or de-soldering will 
be  finished  when  the  temperature  reaches  to  the  peak  value  and  performs  the  next  step.  In 
parameter modifying, use the UP and DOWN key to set the value of T3. 
 
TL                                                                                                                                                                             
Melting temperature of solder. At this temperature, the solder starts to melt down and turn into 
liquid. 
During  the  soldering  and  de-soldering,  users  can  press  CAL  Key  to  calibrate  the  value  of  TL 
when the  solder  turn  into liquid.  In parameter  modifying, use the UP and DOWN knob to set 

Содержание BGA EA-H00

Страница 1: ...ration Manual Thank you for purchasing our BGA SMD Rework System The system is exclusively designed for reworking and soldering SMD component Please carefully read this manual before operating the sys...

Страница 2: ...5 6 1 Place System 5 6 2 Install RPC 5 6 3 System Connecting 5 7 control box Instructions 6 8 IR System Operation 6 8 1 Part Function 6 8 2 Parameters Setting 7 8 3 Operating technics instruction 15 9...

Страница 3: ...lue of temperature for lead free soldering IR EA H00 Rework System adopts micro processor control and infrared sensor technology It has the precision non contact infrared temperature sensor for de sol...

Страница 4: ...a RPC optional computer LCD optional Note The parts will be packed according to the packing list If you don t purchase the optional part it will not be in the package If any part stated above is misse...

Страница 5: ...erators 5 Specifications and Technical Parameters 5 1 Specifications 1 Total power 2400W max 2 Power of Bottom Heater 400W 4 1600W Infrared ceramic heating tube 3 Power of Top Heater 120W 6 720W Infra...

Страница 6: ...perature of top heater S1 Heating time rising from T1 to T2 S2 Heating time rising from T2 to T3 S3 Heat preservation time of T3 IR EA H00 Rework System has ten working modes and its parameter can be...

Страница 7: ...be adjusted Unscrew fixing knob in corresponding direction and then adjust RPC can be moved up and down or turned 6 3 System Connecting Please check whether the supply voltage accords with the rated...

Страница 8: ...te make BGA IR enter solder and desolder E Function of in out suck key cool fan stretch out or retraction in desolder mode when flow reach T3 section it can control IR suck mouth suck chip 8 IR System...

Страница 9: ...0 Flow settings it can modify parameter inside C _type solder Working mode settings D _laser off Laser alignment settings E _baud 19200 Communication speed settings A Input password The initial passw...

Страница 10: ...show 2 If you want to modify the next working flow operate as the following B item If you don t want to modify please press DOWN knob to browse the following parameter settings B Modify working flow...

Страница 11: ...modify the next working mode operate as C item shows If you don t want to modify it yon can press DOWN knob to browse the next parameter settings C Modify working mode For instance Modify the working...

Страница 12: ...e heat preservation starting temperature of reflow soldering It is the second temperature of this technics process The temperature rises to T1 with a proper speed the component permits In parameter mo...

Страница 13: ...sed for measuring temperature besides system s IR sensor The signal of chosen sensor will be displayed and used for process controlling In parameter modifying use the UP and DOWN key to set the value...

Страница 14: ...tate MENU press MENU press MENU rotate MENU press OK press MENU press MENU press MENU T1 130 S1 060s _T1 130 S1 060s T1 130 _S1 060s T1 130 S1 060s S1 070s T2 150 S1 070s T2 150 S1 060s T2 150 S1 060s...

Страница 15: ...ress MENU press MENU MENU rotate MENU press OK rotate MENU rotate MENU rotate MENU press OK TL 183 TB 140 T0 090 T FAN 100S T FAN 100S SPD 80 T2 160 S2 030s T2 160 S2 050s T2 160 S2 050s S2 050s T3 20...

Страница 16: ...Press OK key to exit Now the system has saved all parameter settings IR window will display 3 After all technology parameters have been selected press BEGIN key and the system perform the set flow E S...

Страница 17: ...anical movement of machine until restart 2 When TC is less than 180 during working if the rising temperature is less than 7 and the system will exit the process and display TC raise error 3 If TC is o...

Страница 18: ...rature of Tb and TC during working and indicate when it reaches T0 T1 T2 T3 and TL S1 S2 and S3 are counted down and user can know about the setting value clearly 7 If you see the solder has melted do...

Страница 19: ...ng perform content of selected flow 7 After pressing START key Bottom Heater starts to heat up and Top Heater moves downwards and reach to bottom 8 IR window will show a series of setting temperatures...

Страница 20: ...The other two Fixture Fixing Knobs are used for locking the PCB Fixture to prevent it from moving lengthways and transverse Unscrew PCB Fixing Knobs and move the Slide Block to open the PCB Clamp Bar...

Страница 21: ...the equipment Solder on the glass of Bottom Radiator can be cleaned out with hard object Please be careful not to break down the glass Clean the prism of PL camera with pledget and be careful not to s...

Страница 22: ...echnology flow file which parameter have be edit K type sensor KT1 KT3 only connect K type temperature sensor can display temperature Flow curve display window temperature curve of KT1 KT3 easy to rea...

Страница 23: ...ght Suck height memory sucking height which have be set After setting auto memory this height when suck the same chip next time we can call the saved flow not need adjust counterpoint height Cancel su...

Страница 24: ...re of this flow temperature rise slope temperature change of every heat process and time thus judge if correspond technology flow 2 In curve analysis interface can save or delete current curve or call...

Страница 25: ...ftware and modify parameter If not set parameter protect password people who obtain enter password also modify parameter Language version select can select language china or English Select Chinese the...

Страница 26: ...Changzhou Quick Soldering Co Ltd Add No 11 FengXiang Road Wujin High Tech Industrial Development Zone Jiangsu China Tel 86 519 86225678 Fax 86 519 86558599 Zip code 213167 Website www quick global com...

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