LTE Module Series
EG25-G Hardware Design
EG25-G_Hardware_Design 88 / 100
8
Storage, Manufacturing and
Packaging
8.1.
Storage
EG25-G is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed
below.
1.
Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH.
2.
After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.
Stored at <10% RH.
3.
Devices require bake before mounting, if any circumstances below occurs:
When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity
is >10% before opening the vacuum-sealed bag.
Device mounting cannot be finished within 168 hours at factory conditions of ≤30ºC/60%RH.
4.
If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033
for baking procedure.
NOTE
