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LTE Module Series

EG25-G Hardware Design

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Module

USIM_VDD

USIM_GND

USIM_RST

USIM_CLK

USIM_DATA

0R

0R

0R

100nF

GND

33pF

33pF 33pF

VCC

RST

CLK

IO

VPP

GND

GND

15K

USIM_VDD

(U)SIM Card Connector

Figure 18: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector

In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please
follow the criteria below in (U)SIM circuit design:



Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length
as less than 200mm as possible.



Keep (U)SIM card signals away from RF and VBAT traces.



Assure the ground between the module and the (U)SIM card connector short and wide. Keep the
trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.
Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as
close to (U)SIM card connector as possible. If the ground is complete on customers’ PCB,
USIM_GND can be connected to PCB ground directly.



To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.



In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic
capacitance should not be more than 15pF. The 0Ω resistors should be added in series between the
module and the (U)SIM card to facilitate debugging. The 33pF capacitors are used for filtering
interference of EGSM900MHz. Please note that the (U)SIM peripheral circuit should be close to the
(U)SIM card connector.



The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace
and sensitive occasion are applied, and should be placed close to the (U)SIM card connector.

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Содержание EG25-G

Страница 1: ...EG25 G Hardware Design LTE Module Series Rev EG25 G_Hardware_Design_V1 0 Date 2018 12 12 Status Released www quectel com ...

Страница 2: ...N PROVIDED IS BASED UPON CUSTOMERS REQUIREMENTS QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PR...

Страница 3: ...LTE Module Series EG25 G Hardware Design EG25 G_Hardware_Design 2 100 About the Document History Revision Date Author Description 1 0 2018 12 12 Lorry XU Harry HUANG Initial ...

Страница 4: ...tion 31 3 5 1 3 USB Application with USB Suspension Resume and RI Function 31 3 5 1 4 USB Application without USB Suspension Function 32 3 5 2 Airplane Mode 33 3 6 Power Supply 33 3 6 1 Power Supply Pins 33 3 6 2 Decrease Voltage Drop 34 3 6 3 Reference Design for Power Supply 35 3 6 4 Monitor the Power Supply 36 3 7 Power on and off Scenarios 36 3 7 1 Turn on Module Using the PWRKEY 36 3 7 2 Turn...

Страница 5: ...rement 68 5 3 2 Recommended RF Connector for Antenna Installation 69 6 Electrical Reliability and Radio Characteristics 72 6 1 Absolute Maximum Ratings 72 6 2 Power Supply Ratings 73 6 3 Operation and Storage Temperatures 73 6 4 Current Consumption 74 6 5 RF Output Power 79 6 6 RF Receiving Sensitivity 79 6 7 Electrostatic Discharge 81 6 8 Thermal Consideration 81 7 Mechanical Dimensions 84 7 1 Me...

Страница 6: ... INTERFACES 57 TABLE 19 CHARACTERISTIC OF ADC 57 TABLE 20 PIN DEFINITION OF NETWORK CONNECTION STATUS ACTIVITY INDICATOR 57 TABLE 21 WORKING STATE OF THE NETWORK CONNECTION STATUS ACTIVITY INDICATOR 58 TABLE 22 PIN DEFINITION OF STATUS 59 TABLE 23 BEHAVIORS OF RI 59 TABLE 24 PIN DEFINITION OF USB_BOOT INTERFACE 60 TABLE 25 GNSS PERFORMANCE 61 TABLE 26 PIN DEFINITION OF THE RF ANTENNA 63 TABLE 27 M...

Страница 7: ...TE Module Series EG25 G Hardware Design EG25 G_Hardware_Design 6 100 TABLE 42 DESCRIPTION OF DIFFERENT CODING SCHEMES 96 TABLE 43 GPRS MULTI SLOT CLASSES 97 TABLE 44 EDGE MODULATION AND CODING SCHEMES 99 ...

Страница 8: ...8 REFERENCE CIRCUIT OF U SIM INTERFACE WITH A 6 PIN U SIM CARD CONNECTOR 42 FIGURE 19 REFERENCE CIRCUIT OF USB APPLICATION 43 FIGURE 20 REFERENCE CIRCUIT WITH TRANSLATOR CHIP 46 FIGURE 21 REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT 46 FIGURE 22 PRIMARY MODE TIMING 47 FIGURE 23 AUXILIARY MODE TIMING 48 FIGURE 24 REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC 49 FIGURE 25 REFERENCE CIRCUIT OF S...

Страница 9: ...FERENCED HEATSINK DESIGN HEATSINK AT THE TOP OF THE MODULE 82 FIGURE 42 REFERENCED HEATSINK DESIGN HEATSINK AT THE BACKSIDE OF CUSTOMERS PCB 82 FIGURE 43 MODULE TOP AND SIDE DIMENSIONS 84 FIGURE 44 MODULE BOTTOM DIMENSIONS BOTTOM VIEW 85 FIGURE 45 RECOMMENDED FOOTPRINT TOP VIEW 86 FIGURE 46 TOP VIEW OF THE MODULE 87 FIGURE 47 BOTTOM VIEW OF THE MODULE 87 FIGURE 48 REFLOW SOLDERING THERMAL PROFILE ...

Страница 10: ...ations This document can help customers quickly understand module interface specifications electrical and mechanical details as well as other related information of EG25 G module To facilitate its application in different fields relevant reference design is also provided for customers reference Associated with application note and user guide customers can use the module to design and set up mobile...

Страница 11: ...consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft Wireless devices may cause interference on sensitive medical equipment so please be aware of the restrictions on the use of wireless devices when in hospitals clinics or other healthcare facilities Cellular terminals or mobiles operating over radio signals and cellular network cannot be guarante...

Страница 12: ...ncludes Data only and Telematics versions Data only version does not support voice function while Telematics version supports it With a compact profile of 29 0mm 32 0mm 2 4mm EG25 G can meet almost all requirements for M2M applications such as automotive metering tracking system security router wireless POS mobile computing device PDA phone tablet PC etc EG25 G is an SMD type module which can be e...

Страница 13: ...Bm 2dB for LTE FDD bands Class 3 23dBm 2dB for LTE TDD bands LTE Features Support up to non CA Cat 4 FDD and TDD Support 1 4MHz 20MHz RF bandwidth Support MIMO in DL direction LTE FDD Max 150Mbps DL Max 50Mbps UL LTE TDD Max 130Mbps DL Max 30Mbps UL UMTS Features Support 3GPP R8 DC HSDPA HSPA HSDPA HSUPA and WCDMA Support QPSK 16 QAM and 64 QAM modulation DC HSDPA Max 42Mbps DL HSUPA Max 5 76Mbps ...

Страница 14: ...ve modes but must be the master in long frame synchronization USB Interface Compliant with USB 2 0 specification slave only the data transfer rate can reach up to 480Mbps Used for AT command communication data transmission GNSS NMEA output software debugging firmware upgrade and voice over USB Support USB serial drivers for Windows 7 8 8 1 10 Windows CE 5 0 6 0 7 0 Linux 2 6 3 x 4 1 4 14 Android 4...

Страница 15: ...FOTA RoHS All hardware components are fully compliant with EU RoHS directive 1 1 Within operation temperature range the module is 3GPP compliant 2 2 Within extended temperature range the module remains the ability to establish and maintain a voice SMS data transmission emergency call etc There is no unrecoverable malfunction There are also no effects on radio spectrum and no harm to radio network ...

Страница 16: ...XT USB U SIM PCM UARTs I2C RESET_N 19 2M XO STATUS GPIOs SAW Control IQ Control Duplex SAW Tx PRx DRx WLAN SD BT SGMII Figure 1 Functional Diagram means under development 2 4 Evaluation Board In order to help customers develop applications with EG25 G Quectel supplies an evaluation board EVB USB to RS 232 converter cable earphone antenna and other peripherals to control or test the module NOTE ...

Страница 17: ...GA pads that can be connected to cellular application platform Sub interfaces included in these pads are described in detail in the following chapters Power supply U SIM interface USB interface UART interfaces PCM and I2C interfaces SD card interface Wireless connectivity interfaces SGMII interface ADC interfaces Status indication USB_BOOT interface ...

Страница 18: ...74 75 76 77 78 79 80 81 82 83 84 100 101 102 106 107 111 112 103 104 109 105 110 89 94 98 88 93 97 86 91 96 85 90 95 99 87 92 108 113 RESERVED RESERVED 117 126 125 124 123 122 121 118 127 128 115 USB_BOOT 1 RESERVED 116 140 137 1 1361 135 134 133 132 131 130 129 114 VDD_SDIO Power Pins Signal Pins GND Pins RESERVED RESERVED 141 142 RESERVED RESERVED 143 144 119 120 WLAN Pins RESERVED Pins Bluetoot...

Страница 19: ... EG25 G modules Table 3 I O Parameters Definition Type Description AI Analog input AO Analog output DI Digital input DO Digital output IO Bidirectional OD Open drain PI Power input PO Power output Table 4 Pin Description Power Supply Pin Name Pin No I O Description DC Characteristics Comment VBAT_BB 59 60 PI Power supply for module s baseband part Vmax 4 3V Vmin 3 3V Vnorm 3 8V It must be able to ...

Страница 20: ...ion DC Characteristics Comment STATUS 61 OD Indicate the module operating status The drive current should be less than 0 9mA An external pull up resistor is required If unused keep it open NET_MODE 5 DO Indicate the module network registration mode VOHmin 1 35V VOLmax 0 45V 1 8V power domain Cannot be pulled up before startup If unused keep it open NET_ STATUS 6 DO Indicate the module network acti...

Страница 21: ...er supply for U SIM card For 1 8V U SIM Vmax 1 9V Vmin 1 7V For 3 0V U SIM Vmax 3 05V Vmin 2 7V IOmax 50mA Either 1 8V or 3 0V is supported by the module automatically USIM_DATA 15 IO Data signal of U SIM card For 1 8V U SIM VILmax 0 6V VIHmin 1 2V VOLmax 0 45V VOHmin 1 35V For 3 0V U SIM VILmax 1 0V VIHmin 1 95V VOLmax 0 45V VOHmin 2 55V USIM_CLK 16 DO Clock signal of U SIM card For 1 8V U SIM VO...

Страница 22: ...65 DI Request to send VILmin 0 3V VILmax 0 6V VIHmin 1 2V VIHmax 2 0V 1 8V power domain If unused keep it open DTR 66 DI Data terminal ready sleep mode control VILmin 0 3V VILmax 0 6V VIHmin 1 2V VIHmax 2 0V 1 8V power domain Pull up by default Low level wakes up the module If unused keep it open TXD 67 DO Transmit data VOLmax 0 45V VOHmin 1 35V 1 8V power domain If unused keep it open RXD 68 DI R...

Страница 23: ...in If unused keep it open PCM_OUT 25 DO PCM data output VOLmax 0 45V VOHmin 1 35V PCM_SYNC 26 IO PCM data frame synchronization signal VOLmax 0 45V VOHmin 1 35V VILmin 0 3V VILmax 0 6V VIHmin 1 2V VIHmax 2 0V 1 8V power domain In master mode it is an output signal In slave mode it is an input signal If unused keep it open PCM_CLK 27 IO PCM clock VOLmax 0 45V VOHmin 1 35V VILmin 0 3V VILmax 0 6V VI...

Страница 24: ... more details If unused keep it open SDC2_ DATA2 29 IO SD card SDIO bus DATA2 1 8V signaling VOLmax 0 45V VOHmin 1 4V VILmin 0 3V VILmax 0 58V VIHmin 1 27V VIHmax 2 0V 3 0V signaling VOLmax 0 38V VOHmin 2 01V VILmin 0 3V VILmax 0 76V VIHmin 1 72V VIHmax 3 34V SDIO signal level can be selected according to SD card supported level please refer to SD 3 0 protocol for more details If unused keep it op...

Страница 25: ...0 protocol for more details If unused keep it open SDC2_CLK 32 DO SD card SDIO bus clock 1 8V signaling VOLmax 0 45V VOHmin 1 4V 3 0V signaling VOLmax 0 38V VOHmin 2 01V SDIO signal level can be selected according to SD card supported level please refer to SD 3 0 protocol for more details If unused keep it open SDC2_CMD 33 IO SD card SDIO bus command 1 8V signaling VOLmax 0 45V VOHmin 1 4V VILmin ...

Страница 26: ...ENABLE 127 DO WLAN power control VOLmax 0 45V VOHmin 1 35V 1 8V power domain Active high If unused keep it open SDC1_ DATA3 129 IO WLAN SDIO data bus D3 VOLmax 0 45V VOHmin 1 35V VILmin 0 3V VILmax 0 6V VIHmin 1 2V VIHmax 2 0V 1 8V power domain If unused keep it open SDC1_ DATA2 130 IO WLAN SDIO data bus D2 VOLmax 0 45V VOHmin 1 35V VILmin 0 3V VILmax 0 6V VIHmin 1 2V VIHmax 2 0V 1 8V power domain...

Страница 27: ...d keep it open COEX_UART_ RX 137 DI LTE WLAN BT coexistence signal VILmin 0 3V VILmax 0 6V VIHmin 1 2V VIHmax 2 0V 1 8V power domain Cannot be pulled up before startup If unused keep it open COEX_UART_ TX 138 DO LTE WLAN BT coexistence signal VOLmax 0 45V VOHmin 1 35V 1 8V power domain Cannot be pulled up before startup If unused keep it open BT_RTS 37 DI BT UART request to send VILmin 0 3V VILmax...

Страница 28: ...V power domain If unused keep it open SGMII_MDATA 121 IO SGMII MDIO Management Data Input Output data For 1 8V VILmax 0 58V VIHmin 1 27V VOLmax 0 45V VOHmin 1 4V For 2 85V VILmax 0 71V VIHmin 1 78V VOLmax 0 35V VOHmin 2 14V 1 8V 2 85V power domain Require external pull up to USIM2_VDD and the resistor should be 1 5K If unused keep it open SGMII_MCLK 122 DO SGMII MDIO Management Data Input Output c...

Страница 29: ...P_IN 1 DI Sleep mode control VILmin 0 3V VILmax 0 6V VIHmin 1 2V VIHmax 2 0V 1 8V power domain Cannot be pulled up before startup Low level wakes up the module If unused keep it open W_DISABLE 4 DI Airplane mode control VILmin 0 3V VILmax 0 6V VIHmin 1 2V VIHmax 2 0V 1 8V power domain Pull up by default In low voltage level module can enter into airplane mode If unused keep it open AP_READY 2 DI A...

Страница 30: ...ceive data Talk Data Network connection is ongoing In this mode the power consumption is decided by network setting and data transfer rate Minimum Functionality Mode AT CFUN command can set the module to a minimum functionality mode without removing the power supply In this case both RF function and U SIM card will be invalid Airplane Mode AT CFUN command or W_DISABLE pin can set the module to air...

Страница 31: ...Execute AT QSCLK 1 command to enable sleep mode Drive DTR to high level The following figure shows the connection between the module and the host RXD TXD RI DTR AP_READY TXD RXD EINT GPIO GPIO Module Host GND GND Figure 3 Sleep Mode Application via UART Driving the host DTR to low level will wake up the module When EG25 G has a URC to report RI signal will wake up the host Please refer to Chapter ...

Страница 32: ...SB_DP USB_DM AP_READY VDD USB_DP USB_DM GPIO Module Host GND GND Figure 4 Sleep Mode Application with USB Remote Wakeup Sending data to EG25 G through USB will wake up the module When EG25 G has a URC to report the module will send remote wake up signals via USB bus so as to wake up the host 3 5 1 3 USB Application with USB Suspension Resume and RI Function If the host supports USB suspension and ...

Страница 33: ...the host 3 5 1 4 USB Application without USB Suspension Function If the host does not support USB suspension function USB_VBUS should be disconnected via an additional control circuit to let the module enter into sleep mode Execute AT QSCLK 1 command to enable the sleep mode Ensure the DTR is held at high level or keep it open Disconnect USB_VBUS The following figure shows the connection between t...

Страница 34: ...evel will let the module enter into airplane mode Software AT CFUN command provides the choice of the functionality level through setting fun into 0 1 or 4 AT CFUN 0 Minimum functionality mode Both U SIM and RF functions are disabled AT CFUN 1 Full functionality mode by default AT CFUN 4 Airplane mode RF function is disabled 1 The W_DISABLE control function is disabled in firmware by default It ca...

Страница 35: ...ng Burst Transmission To decrease voltage drop a bypass capacitor of about 100µF with low ESR ESR 0 7Ω should be used and a multi layer ceramic chip MLCC capacitor array should also be reserved due to its ultra low ESR It is recommended to use three ceramic capacitors 100nF 33pF 10pF for composing the MLCC array and place these capacitors close to VBAT_BB VBAT_RF pins The main power supply from an...

Страница 36: ...urrent up to 2A at least If the voltage drop between the input and output is not too high it is suggested that an LDO should be used to supply power for the module If there is a big voltage difference between the input source and the desired output VBAT a buck converter is preferred to be used as the power supply The following figure shows a reference design for 5V input power source The typical o...

Страница 37: ...ollowing table shows the pin definition of PWRKEY Table 7 Pin Definition of PWRKEY Pin Name Pin No I O Description Comment PWRKEY 21 DI Turn on off the module The output voltage is 0 8V because of the diode drop in the Qualcomm chipset When EG25 G is in power down mode it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms It is recommended to use an open dr...

Страница 38: ...r ESD protection A reference circuit is shown in the following figure PWRKEY S1 Close to S1 TVS Figure 11 Turn on the Module by Using Keystroke The power on scenario is illustrated in the following figure VIL 0 5V VIH 1 3V VBAT PWRKEY 500ms RESET_N STATUS OD Inactive Active UART NOTE Inactive Active USB 2 5s 12s 13s VDD_EXT About 100ms BOOT_CONFIG USB_BOOT 100ms Ater this time the BOOT_CONFIG pin ...

Страница 39: ...mmand 3 7 2 1 Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650ms the module will execute power down procedure after the PWRKEY is released The power off scenario is illustrated in the following figure VBAT PWRKEY 29 5s 650ms RUNNING Power down procedure OFF Module Status STATUS OD Figure 13 Power off Scenario of Module 3 7 2 2 Turn off Module Usin...

Страница 40: ...ise the module will be turned on again after successfully turn off 3 8 Reset the Module The RESET_N pin can be used to reset the module The module can be reset by driving RESET_N to a low level voltage for time between 150ms and 460ms Table 8 RESET_N Pin Description Pin Name Pin No I O Description Comment RESET_N 20 DI Reset the module 1 8V power domain The recommended circuit is similar to the PW...

Страница 41: ...L 0 5V VIH 1 3V VBAT 150ms Resetting Module Status Running RESET_N Restart 460ms Figure 16 Timing of Resetting Module 1 Use RESET_N only when failed to turn off the module by AT QPOWD command and PWRKEY pin 2 Ensure that there is no large capacitance on PWRKEY and RESET_N pins 3 9 U SIM Interface The U SIM interface circuitry meets ETSI and IMT 2000 requirements Both 1 8V and 3 0V U SIM cards are ...

Страница 42: ... hot plug via the USIM_PRESENCE pin The function supports low level and high level detections and is disabled by default Please refer to document 2 for more details about AT QSIMDET command The following figure shows a reference design for U SIM interface with an 8 pin U SIM card connector Module USIM_VDD USIM_GND USIM_RST USIM_CLK USIM_DATA USIM_PRESENCE 0R 0R 0R VDD_EXT 51K 100nF GND GND 33pF 33...

Страница 43: ...m to maintain the same electric potential Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF and place it as close to U SIM card connector as possible If the ground is complete on customers PCB USIM_GND can be connected to PCB ground directly To avoid cross talk between USIM_DATA and USIM_CLK keep them away from each other and shield them with surrounded ground In order to ...

Страница 44: ... of USB Interface Pin Name Pin No I O Description Comment USB_DP 69 IO USB differential data bus Require differential impedance of 90Ω USB_DM 70 IO USB differential data bus Require differential impedance of 90Ω USB_VBUS 71 PI USB connection detection Typical 5 0V GND 72 Ground For more details about the USB 2 0 specifications please visit http www usb org home The USB interface is recommended to ...

Страница 45: ... traces under crystals oscillators magnetic devices and RF signal traces It is important to route the USB differential traces in inner layer with ground shielding on not only upper and lower layers but also right and left sides Pay attention to the influence of junction capacitance of ESD protection components on USB data lines Typically the capacitance value should be less than 2pF Keep the ESD p...

Страница 46: ... 12 Pin Definition of Debug UART Interface Pin Name Pin No I O Description Comment DBG_TXD 12 DO Transmit data 1 8V power domain DBG_RXD 11 DI Receive data The logic levels are described in the following table Table 13 Logic Levels of Digital I O Parameter Min Max Unit VIL 0 3 0 6 V VIH 1 2 2 0 V VOL 0 0 45 V VOH 1 35 1 8 V The module provides 1 8V UART interface A level translator should be used ...

Страница 47: ...nother example with transistor translation circuit is shown as below The circuit design of dotted line section can refer to the design of solid line section in terms of both module s input and output circuit designs but please pay attention to the direction of connection MCU ARM TXD RXD VDD_EXT 10K VCC_MCU 4 7K 10K VDD_EXT TXD RXD RTS CTS DTR RI RTS CTS GND GPIO DCD Module GPIO EINT VDD_EXT 4 7K G...

Страница 48: ... interface supports 256kHz 512kHz 1024kHz or 2048kHz PCM_CLK at 8kHz PCM_SYNC and also supports 4096kHz PCM_CLK at 16kHz PCM_SYNC In auxiliary mode the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge The PCM_SYNC rising edge represents the MSB In this mode the PCM interface operates with a 256kHz 512kHz 1024kHz or 2048kHz PCM_CLK and an 8kHz 50 duty cycle PCM_...

Страница 49: ...CM_OUT 25 DO PCM data output 1 8V power domain PCM_SYNC 26 IO PCM data frame synchronization signal 1 8V power domain PCM_CLK 27 IO PCM data bit clock 1 8V power domain I2C_SCL 41 OD I2C serial clock Require external pull up to 1 8V I2C_SDA 42 OD I2C serial data Require external pull up to 1 8V Clock and mode can be configured by AT command and the default configuration is master mode using short ...

Страница 50: ...vice pertaining to I2C interface 3 13 SD Card Interface EG25 G supports SDIO 3 0 interface for SD card The following table shows the pin definition of SD card interface Table 15 Pin Definition of SD Card Interface Pin Name Pin No I O Description Comment SDC2_DATA3 28 IO SD card SDIO bus DATA3 SDIO signal level can be selected according to SD card supported level please refer to SD 3 0 protocol for...

Страница 51: ...d with SD_INS_DET must be connected The voltage range of SD card power supply VDD_3V is 2 7V 3 6V and a sufficient current up to 0 8A should be provided As the maximum output current of VDD_SDIO is 50mA which can only be used for SDIO pull up resistors an externally power supply is needed for SD card To avoid jitter of bus resistors R7 R11 are needed to pull up the SDIO to VDD_SDIO Value of these ...

Страница 52: ... for BT The following table shows the pin definition of wireless connectivity interfaces Table 16 Pin Definition of Wireless Connectivity Interfaces Pin Name Pin No I O Description Comment WLAN Part SDC1_DATA3 129 IO WLAN SDIO data bus D3 1 8V power domain SDC1_DATA2 130 IO WLAN SDIO data bus D2 1 8V power domain SDC1_DATA1 131 IO WLAN SDIO data bus D1 1 8V power domain SDC1_DATA0 132 IO WLAN SDIO...

Страница 53: ... data 1 8V power domain BT_RXD 39 DI BT UART receive data 1 8V power domain BT_CTS 40 DO BT UART clear to send 1 8V power domain Cannot be pulled up before startup PCM_IN 1 24 DI PCM data input 1 8V power domain PCM_OUT 1 25 DO PCM data output 1 8V power domain PCM_SYNC 1 26 IO PCM data frame synchronization signal 1 8V power domain PCM_CLK 1 27 IO PCM data bit clock 1 8V power domain BT_EN 139 DO...

Страница 54: ..._UART_TX COEX_UART_RX LTE_UART_TXD LTE_UART_RXD COEX Bluetooth Figure 26 Reference Circuit of Wireless Connectivity Interfaces with FC20 Module 1 FC20 module can only be used as a slave device 2 When BT function is enabled on EG25 G module PCM_SYNC and PCM_CLK pins are only used to output signals 3 1 Pads 24 27 are multiplexing pins used for audio design on EG25 G module and BT function on FC20 mo...

Страница 55: ...nd keep the route distance from the module clock pins to termination resistors less than 5mm Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15pF 3 14 2 BT Interface EG25 G supports a dedicated UART interface and a PCM interface for BT application Further information about BT interface will be added in future version of this document means under ...

Страница 56: ...ta Input Output clock 1 8V 2 85V power domain USIM2_VDD 128 PO SGMII MDIO pull up power source Configurable power source 1 8V 2 85V configurable External pull up power source for SGMII MDIO pins SGMII Signal Part SGMII_TX_M 123 AO SGMII transmission minus Connect with a 0 1uF capacitor and close to the PHY side SGMII_TX_P 124 AO SGMII transmission plus SGMII_RX_P 125 AI SGMII receiving plus Connec...

Страница 57: ...rol signals away from other sensitive circuits signals such as RF circuits analog signals etc as well as noisy signals such as clock signals DCDC signals etc Keep the maximum trace length less than 10 inch and keep skew on the differential pairs less than 20mil The differential impedance of SGMII data trace is 100Ω 10 and the reference ground of the area should be complete Make sure the trace spac...

Страница 58: ...rohibited to supply any voltage to ADC pins when VBAT is removed 3 It is recommended to use resistor divider circuit for ADC application 3 17 Network Status Indication The network indication pins can be used to drive network status indication LEDs The module provides two pins which are NET_MODE and NET_STATUS The following tables describe pin definition and logic level changes in different network...

Страница 59: ... Flicker quickly 125ms High 125ms Low Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure 4 7K 47K VBAT 2 2K Module Network Indicator Figure 29 Reference Circuit of the Network Indicator 3 18 STATUS The STATUS pin is an open drain output for indicating the module s operation status It can be connected to a GPIO of DTE with a pull up resistor or a...

Страница 60: ...ds VDD_MCU 10K Module STATUS MCU_GPIO Module STATUS VBAT 2 2K Figure 30 Reference Circuits of STATUS 3 19 Behaviors of RI AT QCFG risignaltype physical command can be used to configure RI behavior No matter on which port a URC is presented the URC will trigger the behavior of RI pin URC can be outputted from UART port USB AT port and USB modem port through configuration via AT QURCCFG command The ...

Страница 61: ...e thus the module will enter into emergency download mode when powered on In this mode the module supports firmware upgrade over USB interface Table 24 Pin Definition of USB_BOOT Interface Pin Name Pin No I O Description Comment USB_BOOT 115 DI Force the module to enter into emergency download mode 1 8V power domain Active high It is recommended to reserve test point The following figure shows a r...

Страница 62: ...y default By default EG25 G GNSS engine is switched off It has to be switched on via AT command For more details about GNSS engine technology and configurations please refer to document 3 4 2 GNSS Performance The following table shows GNSS performance of EG25 G Table 25 GNSS Performance Parameter Description Conditions Typ Unit Sensitivity GNSS Cold start Autonomous 146 dBm Reacquisition Autonomou...

Страница 63: ...the antenna port on which the module fixes position within 3 minutes after executing cold start command 4 3 Layout Guidelines The following layout guidelines should be taken into account in customers designs Maximize the distance among GNSS antenna main antenna and Rx diversity antenna Digital circuits such as U SIM card USB interface camera module and display connector should be kept away from th...

Страница 64: ...nna Interfaces 5 1 1 Pin Definition The pin definition of main antenna and Rx diversity antenna interfaces is shown below Table 26 Pin Definition of the RF Antenna Pin Name Pin No I O Description Comment ANT_MAIN 49 IO Main antenna pad 50Ω impedance ANT_DIV 35 AI Receive diversity antenna pad 50Ω impedance If unused keep it open 5 1 2 Operating Frequency Table 27 Module Operating Frequencies 3GPP ...

Страница 65: ...805 1880 MHz LTE FDD B4 1710 1755 2110 2155 MHz LTE FDD B5 824 849 869 894 MHz LTE FDD B7 2500 2570 2620 2690 MHz LTE FDD B8 880 915 925 960 MHz LTE FDD B12 699 716 729 746 MHz LTE FDD B13 777 787 746 756 MHz LTE FDD B18 815 830 860 875 MHz LTE FDD B19 830 845 875 890 MHz LTE FDD B20 832 862 791 821 MHz LTE FDD B25 1850 1915 1930 1995 MHz LTE FDD B26 814 849 859 894 MHz LTE FDD B28 703 748 758 803...

Страница 66: ...n is enabled by default AT QCFG diversity 0 command can be used to disable receive diversity Please refer to document 2 for details 3 Place the π type matching components R1 C1 C2 R2 C3 C4 as close to the antenna as possible 5 1 4 Reference Design of RF Layout For user s PCB the characteristic impedance of all RF traces should be controlled as 50Ω The impedance of the RF traces is usually determin...

Страница 67: ... Hardware Design EG25 G_Hardware_Design 66 100 Figure 33 Microstrip Design on a 2 layer PCB Figure 34 Coplanar Waveguide Design on a 2 layer PCB Figure 35 Coplanar Waveguide Design on a 4 layer PCB Layer 3 as Reference Ground ...

Страница 68: ...e right angle traces should be changed to curved ones There should be clearance area under the signal pin of the antenna connector or solder joint The reference ground of RF traces should be complete Meanwhile adding some ground vias around RF traces and the reference ground could help to improve RF performance The distance between the ground vias and RF traces should be no less than two times the...

Страница 69: ... as below GNSS Antenna VDD Module ANT_GNSS 47nH 10R 0 1uF 100pF NM NM Figure 37 Reference Circuit of GNSS Antenna 1 An external LDO can be selected to supply power according to the active antenna requirement 2 If the module is designed with a passive antenna then the VDD circuit is not needed 5 3 Antenna Installation 5 3 1 Antenna Requirement The following table shows the requirements on main ante...

Страница 70: ...put impedance Ω 50 Polarization type Vertical Cable insertion loss 1dB GSM850 EGSM900 WCDMA B5 B6 B8 B19 LTE B5 B8 B12 B13 B18 B19 B20 B26 B28 Cable insertion loss 1 5dB DCS1800 PCS1900 WCDMA B1 B2 B4 LTE B1 B2 B3 B4 B25 B39 Cable insertion loss 2dB LTE B7 B38 B40 B41 1 It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported as the use of active antenna may generate harmon...

Страница 71: ...re Design EG25 G_Hardware_Design 70 100 Figure 38 Dimensions of the U FL R SMT Connector Unit mm U FL LP serial connectors listed in the following figure can be used to match the U FL R SMT Figure 39 Mechanicals of U FL LP Connectors ...

Страница 72: ...s EG25 G Hardware Design EG25 G_Hardware_Design 71 100 The following figure describes the space factor of mated connector Figure 40 Space Factor of Mated Connector Unit mm For more details please visit http hirose com ...

Страница 73: ... ratings for power supply and voltage on digital and analog pins of the module are listed in the following table Table 31 Absolute Maximum Ratings Parameter Min Max Unit VBAT_RF VBAT_BB 0 3 4 7 V USB_VBUS 0 3 5 5 V Peak Current of VBAT_BB 0 0 8 A Peak Current of VBAT_RF 0 1 8 A Voltage at Digital Pins 0 3 2 3 V Voltage at ADC0 0 VBAT_BB V Voltage at ADC1 0 VBAT_BB V ...

Страница 74: ...rage temperatures are listed in the following table Table 33 Operation and Storage Temperatures Parameter Min Typ Max Unit Operation Temperature Range 1 35 25 75 ºC Extended Operation Range 2 40 85 ºC Storage Temperature Range 40 90 ºC 1 1 Within operation temperature range the module is 3GPP compliant 2 2 Within extended temperature range the module remains the ability to establish and maintain a...

Страница 75: ...3 mA DCS DRX 2 USB disconnected 2 9 mA DCS DRX 5 USB disconnected 2 4 mA DCS DRX 5 USB suspended 2 5 mA DCS DRX 9 USB disconnected 2 3 mA WCDMA PF 64 USB disconnected 2 7 mA WCDMA PF 64 USB suspended 2 9 mA WCDMA PF 128 USB disconnected 2 3 mA WCDMA PF 256 USB disconnected 2 1 mA WCDMA PF 512 USB disconnected 2 0 mA LTE FDD PF 32 USB disconnected 4 3 mA LTE FDD PF 64 USB disconnected 3 2 mA LTE FD...

Страница 76: ...SB connected 29 mA LTE TDD PF 64 USB disconnected 18 mA LTE TDD PF 64 USB connected 29 mA GPRS data transfer GNSS OFF GSM900 4DL 1UL 32 5dBm 280 mA GSM900 3DL 2UL 32dBm 530 mA GSM900 2DL 3UL 30dBm 601 mA GSM900 1DL 4UL 29dBm 658 mA GSM850 4DL 1UL 32 5dBm 285 mA GSM850 3DL 2UL 32dBm 532 mA GSM850 2DL 3UL 30dBm 610 mA GSM850 1DL 4UL 29dBm 680 mA DCS1800 4DL 1UL 29 5dBm 162 mA DCS1800 3DL 2UL 29dBm 2...

Страница 77: ...A DCS1800 3DL 2UL 25dBm 371 mA DCS1800 2DL 3UL 23dBm 522 mA DCS1800 1DL 4UL 22dBm 670 mA PCS1900 4DL 1UL 26dBm 210 mA PCS1900 3DL 2UL 25dBm 370 mA PCS1900 2DL 3UL 23dBm 525 mA PCS1900 1DL 4UL 22dBm 670 mA WCDMA data transfer GNSS OFF WCDMA B1 HSDPA 21dBm 546 mA WCDMA B1 HSUPA 20 5dBm 530 mA WCDMA B2 HSDPA 21dBm 580 mA WCDMA B2 HSUPA 20 5dBm 560 mA WCDMA B4 HSDPA 21dBm 565 mA WCDMA B4 HSUPA 20 5dBm...

Страница 78: ...FDD B7 22 3dBm 746 mA LTE FDD B8 22 3dBm 648 mA LTE FDD B12 22 3dBm 600 mA LTE FDD B13 22 3dBm 690 mA LTE FDD B18 22 3dBm 710 mA LTE FDD B19 22 3dBm 680 mA LTE FDD B20 22 3dBm 730 mA LTE FDD B25 22 3dBm 750 mA LTE FDD B26 22 3dBm 690 mA LTE FDD B28 22 3dBm 710 mA LTE TDD B38 22 3dBm 490 mA LTE TDD B39 22 3dBm 435 mA LTE TDD B40 22 3dBm 470 mA LTE TDD B41 22 3dBm 490 mA GSM voice call GSM900PCL 5 3...

Страница 79: ... voice call WCDMA B1 22 5dBm 605 mA WCDMA B2 22 5dBm 630 mA WCDMA B4 22 5dBm 550 mA WCDMA B5 22 5dBm 550 mA WCDMA B6 22 5dBm 590 mA WCDMA B8 22 5dBm 550 mA WCDMA B19 22 5dBm 545 mA Table 35 GNSS Current Consumption of EG25 G Module Parameter Description Conditions Typ Unit IVBAT GNSS Searching AT CFUN 0 Cold start Passive Antenna 47 mA Lost state Passive Antenna 47 mA Tracking AT CFUN 0 Instrument...

Страница 80: ...49dBm LTE FDD B1 B2 B3 B4 B5 B7 B8 B12 B13 B18 B19 B20 B25 B26 B28 23dBm 2dB 39dBm LTE TDD B38 B39 B40 B41 23dBm 2dB 39dBm In GPRS 4 slots TX mode the maximum output power is reduced by 3dB The design conforms to the GSM specification as described in Chapter 13 16 of 3GPP TS 51 010 1 6 6 RF Receiving Sensitivity The following tables show conducted RF receiving sensitivity of EG25 G module Table 37...

Страница 81: ...94 3dBm LTE FDD B3 10M 97 5dBm 98 1dBm 99 7dBm 93 3dBm LTE FDD B4 10M 97 8dBm 98 2dBm 99 7dBm 96 3dBm LTE FDD B5 10M 98dBm 98 5dBm 99 9dBm 94 3dBm LTE FDD B7 10M 97 3dBm 97 6dBm 99 2dBm 94 3dBm LTE FDD B8 10M 98dBm 98dBm 99 8dBm 93 3dBm LTE FDD B12 10M 98dBm 98 3dBm 99 8dBm 93 3dBm LTE FDD B13 10M 98dBm 98dBm 99 5dBm 93 3dBm LTE FDD B18 10M 98dBm 99 4dBm 100dBm 96 3dBm LTE FDD B19 10M 98dBm 98 8dB...

Страница 82: ...Thermal Consideration In order to achieve better performance of the module it is recommended to comply with the following principles for thermal consideration On customers PCB design please keep placement of the module away from heating sources especially high power components such as ARM processor audio power amplifier power supply etc Do not place components on the opposite side of the PCB area ...

Страница 83: ...shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure Heatsink EG25 G Module Application Board Application Board Heatsink Thermal Pad Shielding Cover Figure 41 Referenced Heatsink Design Heatsink at the Top of the Module Thermal Pad Heatsink Application Board Application Board Heatsink Thermal Pad EG25 G Module Shiel...

Страница 84: ...hen the maximum BB chip temperature reaches or exceeds 115 C the module will disconnect from the network and it will recover to network connected state after the maximum temperature falls below 115 C Therefore the thermal design should be maximally optimized to make sure the maximum BB chip temperature always maintains below 105 C Customers can execute AT QTEMP command and get the maximum BB chip ...

Страница 85: ...l Dimensions This chapter describes the mechanical dimensions of the module All dimensions are measured in mm The tolerances for dimensions without tolerance values are 0 05mm 7 1 Mechanical Dimensions of the Module 32 0 15 29 0 15 0 8 2 4 0 2 Figure 43 Module Top and Side Dimensions ...

Страница 86: ...e_Design 85 100 2 0 2 0 3 5 1 50 3 2 3 4 3 2 3 4 3 2 6 75 3 5 32 0 15 2 8 4 8 0 82 5 96 1 6 2 15 4 4 1 7 4 88 1 8 1 8 1 15 1 05 1 10 1 10 29 0 15 1 30 2 40 2 49 3 45 1 30 3 0 3 85 1 30 0 80 1 25 1 90 3 35 1 30 Figure 44 Module Bottom Dimensions Bottom View ...

Страница 87: ...ded Footprint Top View 1 The keepout area should not be designed 2 For easy maintenance of the module please keep about 3mm between the module and other components in the host PCB 3 EG25 G share the same recommended footprint with EC25 but different recommended stencil Refer to document 4 for more information NOTES ...

Страница 88: ...Design 87 100 7 3 Design Effect Drawings of the Module Figure 46 Top View of the Module Figure 47 Bottom View of the Module These are design effect drawings of EG25 G module For more accurate pictures please refer to the module that you get from Quectel NOTE ...

Страница 89: ... the factory environment of 30ºC 60 RH Stored at 10 RH 3 Devices require bake before mounting if any circumstances below occurs When the ambient temperature is 23ºC 5ºC and the humidity indicator card shows the humidity is 10 before opening the vacuum sealed bag Device mounting cannot be finished within 168 hours at factory conditions of 30ºC 60 RH 4 If baking is required devices may be baked for ...

Страница 90: ...t the peak reflow temperature is 240ºC 245ºC and the absolute maximum reflow temperature is 245ºC To avoid damage to the module caused by repeated heating it is strongly recommended that the module should be mounted after reflow soldering for the other side of PCB has been completed The recommended reflow soldering thermal profile lead free reflow soldering and related parameters are shown below T...

Страница 91: ...les The figure below shows the package details measured in mm 30 3 0 15 29 3 0 15 30 3 0 15 32 5 0 15 33 5 0 15 0 35 0 05 4 2 0 15 3 1 0 15 32 5 0 15 33 5 0 15 4 00 0 1 2 00 0 1 1 75 0 1 20 20 0 15 44 00 0 3 44 00 0 1 1 50 0 1 Max slope 2 to 3 C sec Reflow time D over 220 C 40 to 60 sec Max temperature 240 C 245 C Cooling down slope 1 to 4 C sec Reflow Cycle Max reflow cycle 1 ...

Страница 92: ...LTE Module Series EG25 G Hardware Design EG25 G_Hardware_Design 91 100 Direction of feed Cover tape 13 100 44 5 0 20 0 00 48 5 Figure 49 Tape and Reel Specifications ...

Страница 93: ...ual GNSS AT Commands Manual for EC25 EC21 EC20 R2 0 EC20 R2 1 EG95 EG91 EG25 G and EM05 modules 4 Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide 5 Quectel_EG25 G_Reference_Design EG25 G Reference Design 6 Quectel_RF_Layout_Application_Note RF Layout Application Note 7 Quectel_LTE_Module_Thermal_Design_Guide Thermal design guide for LTE modules including EC25 EC21 EC20 R2 0...

Страница 94: ...D Frequency Division Duplex FR Full Rate GLONASS GLObalnaya NAvigatsionnaya Sputnikovaya Sistema the Russian Global Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System GPS Global Positioning System GSM Global System for Mobile Communications HR Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink ...

Страница 95: ...drature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RHCP Right Hand Circularly Polarized Rx Receive SGMII Serial Gigabit Media Independent Interface SIM Subscriber Identification Module SIMO Single Input Multiple Output SMS Short Message Service TDD Time Division Duplexing TDMA Time Division Multiple Access TD SCDMA Time Division Synchronous Code Division Multiple Ac...

Страница 96: ...e Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Rat...

Страница 97: ...chemes Table 42 Description of Different Coding Schemes Scheme CS 1 CS 2 CS 3 CS 4 Code Rate 1 2 2 3 3 4 1 USF 3 3 3 3 Pre coded USF 3 6 6 12 Radio Block excl USF and BCS 181 268 312 428 BCS 40 16 16 16 Tail 4 4 4 Coded Bits 456 588 676 456 Punctured Bits 0 132 220 Data Rate Kb s 9 05 13 4 15 6 21 4 ...

Страница 98: ...r 2 2 the first number indicates the amount of downlink timeslots while the second number indicates the amount of uplink timeslots The active slots determine the total number of slots the GPRS device can use simultaneously for both uplink and downlink communications The description of different multi slot classes is shown in the following table Table 43 GPRS Multi slot Classes Multislot Class Down...

Страница 99: ...e Design EG25 G_Hardware_Design 98 100 14 4 4 NA 15 5 5 NA 16 6 6 NA 17 7 7 NA 18 8 8 NA 19 6 2 NA 20 6 3 NA 21 6 4 NA 22 6 4 NA 23 6 6 NA 24 8 2 NA 25 8 3 NA 26 8 4 NA 27 8 4 NA 28 8 6 NA 29 8 8 NA 30 5 1 6 31 5 2 6 32 5 3 6 33 5 4 6 ...

Страница 100: ...GMSK 13 4kbps 26 8kbps 53 6kbps CS 3 GMSK 15 6kbps 31 2kbps 62 4kbps CS 4 GMSK 21 4kbps 42 8kbps 85 6kbps MCS 1 GMSK C 8 80kbps 17 60kbps 35 20kbps MCS 2 GMSK B 11 2kbps 22 4kbps 44 8kbps MCS 3 GMSK A 14 8kbps 29 6kbps 59 2kbps MCS 4 GMSK C 17 6kbps 35 2kbps 70 4kbps MCS 5 8 PSK B 22 4kbps 44 8kbps 89 6kbps MCS 6 8 PSK A 29 6kbps 59 2kbps 118 4kbps MCS 7 8 PSK B 44 8kbps 89 6kbps 179 2kbps MCS 8 8...

Страница 101: ...s device contains FCC ID XMR201903EG25G 4 To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation maximum antenna gain including cable loss must not exceed Operating Band FCC Max Antenna Gain dBi IC Max Antenna Gain dBi GSM850 8 60 7 44 GSM1900 10 19 10 19 WCDMA BAND II 8 00 8 00 WCDMA BAND IV 5 00 5 00 WCDMA BAND V 9 42 8 26 LTE BAND 2 8 00 8 00 LTE...

Страница 102: ...er that changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment In cases where the manual is provided only in a form other than paper such as on a computer disk or over the Internet the information required by this section may be included in the manual in that alternative form provided the user can reasonably ...

Страница 103: ... Innovation Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product otherwise the host product must be labeled to display the Innovation Science and Economic Development Canada certification number for the module preceded by the word Contains or similar wording expressing the same meaning as follows Contains I...

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