Quectel EG25-G, Проектирование аппаратного обеспечения

Страница: 9 / 103

LTE Module Series
EG25-G Hardware Design
EG25-G_Hardware_Design 8 / 100
FIGURE 38: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 70
FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 70
FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 71
FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) .................. 82
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
...................................................................................................................................................................
82
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 84
FIGURE 44: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 85
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 86
FIGURE 46: TOP VIEW OF THE MODULE ...................................................................................................... 87
FIGURE 47: BOTTOM VIEW OF THE MODULE .............................................................................................. 87
FIGURE 48: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 89
FIGURE 49: TAPE AND REEL SPECIFICATIONS ........................................................................................... 91