PEX 8647-AA RDK Hardware Reference Manual, Version 1.2
Copyright © 2008 by PLX Technology, Inc. All rights reserved
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1.2
PEX 8647-AA RDK Features
•
PLX PEX 8647 PCI Express switch in a 676-ball Flip-Chip Plastic BGA package
•
Form factor based on PCI Express Card Electromechanical (CEM) Specification 2.0
•
Two downstream PCI Express slot connectors that are spaced to accommodate SLI and Cross-Fire
cables
•
Six x8 Gen 2 Midbus footprints for 48 lane PCI Express signal probing
•
On-board PCI Express RefClk buffer which supports Spread Spectrum Clocking
•
Socketable Serial EEPROM (2.5V)
•
Two standard 2x2 headers provides the I
2
C interface to an I
2
C master
•
DIP switch for I
2
C address settings
•
Manual push-button PERST# capability
•
Three Port Status indicator LEDs for visual inspection of link speed and status
•
Two ATX Hard disk Power connectors supply a maximum of 150 watts to the downstream slots
•
Voltage level monitoring circuit for 1.0V and 2.5V power to the PEX 8647
