PCM-061/phyCORE-i.MX7 System on Module
L-821e_2
© PHYTEC America L.L.C. 2017
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12
Hints for Integrating and Handling the phyCORE-i.MX7
12.1
Integrating the phyCORE-i.MX7
Successful integration of the phyCORE-i.MX7 SOM into target circuitry greatly depends on adherence to the layout design
rules for the GND connections of the phyCORE module. As a general design rule, we recommend connecting all GND pins
neighboring signals which are being used in application circuitry. At least one ground pin should be connected for every
power pin used. For maximum EMI performance, all GND pins should be connected to a solid ground plane.
Additional information is available to facilitate the integration of the phyCORE-i.MX7 into customer applications, such as:
•
phyCORE-i.MX7 Carrier Board schematic reference. Schematics are made available upon request.
•
phyCORE-iMX7
Pins
file:
http://develop.phytec.com/display/public/PRODUCTINFO/phyCORE-i.MX7#Landing-
409943289
•
Phone, e-mail, FAQ, wiki, and other online support by visiting
http://phytec.com/contact/
12.2
Handling the phyCORE-i.MX7
Removal of various components, such as the microcontroller and the standard quartz, is not advisable given the compact
nature of the module. Should this nonetheless be necessary, please ensure that the board as well as surrounding
components and sockets remain undamaged while de-soldering. Overheating the board can cause the solder pads to
loosen, rendering the module inoperable. Carefully heat neighboring connections in pairs. After a few alternations,
components can be removed with the solder-iron tip. Alternatively, a hot air gun can be used to heat and loosen the
bonds.
WARNING:
Modifications to the SOM, regardless of their nature, will void the warranty.
