reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices,
place the assembly on a conductive surface such as aluminum
foil, to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an antistatic solder removal device. Some solder
removal devices not classified as "antistatic (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed.
CAUTION:Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement
ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor cangenerate static electricity (ESD) sufficient to
damage an ES device).
"NOTE to CATV system installer:
This reminder is provided to call the CATV system installer's attention to Article 820-22 of the
NEC that provides guidelines for proper grounding and, in particular, specifies that the cable
ground shall be connectedto the grounding system of the building, as close to the point of
cable entry as practical."
3. OPERATION GUIDE
Содержание OmniVision PV-QV200
Страница 24: ...5 2 2 Inner Parts Location Fig J1 1 ...
Страница 25: ...5 2 3 EJECT Position Confirmation Fig J1 2 ...
Страница 26: ...5 2 4 Grounding Plate Unit Full Erase Head and Cylinder Unit Fig J2 1 ...
Страница 40: ...5 3 CASSETTE UP ASS Y SECTION 5 3 1 Top Plate Wiper Arm Unit and Holder Unit Fig K1 1 ...
Страница 86: ...10 2 MECHANISM BOTTOM SECTION ...
Страница 87: ...10 3 CASSETTE UP COMPARTMENT SECTION ...
Страница 88: ...10 4 CHASSIS FRAME AND CASING PARTS SECTION ...
Страница 89: ...10 5 PACKING PARTS AND ACCESSORIES SECTION ...
Страница 117: ...R3036 ERJ6GEYJ122V MGF CHIP 1 10W 1 2K ...
Страница 123: ...ECKATS101MB CERAMIC 20 250V 100P ...
Страница 125: ...C3021 ECUV1C224ZFV C CHIP 80 20 16V 0 22 ...