(266°F ~ 302°F)
(130°C ~150°C) for about 2 minutes.
Note:
A. Leadless components must not be reused after removal.
B. Excessive mechanical stress and rubbing of the component
electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers and alternately
apply heat to both electrodes. When the solder on both electrodes
is melted, remove the leadless component with a twisting motion.
Note:
A. Do not attempt to lift the component off the board until the
component is completely disconnected from the board by a
twisting action.
B. Be careful not to break the copper foil on the printed circuit
board.
Fig. 8-1
3. Installing the leadless component
A. Presolder the contact points on the circuit board.
Fig. 8-2
B. Press the part downward with tweezers and solder both
electrodes as shown below.
Fig. 8-3
Note:
Do not glue the replacement leadless component to the circuit
Содержание OmniVision PV-QV200
Страница 24: ...5 2 2 Inner Parts Location Fig J1 1 ...
Страница 25: ...5 2 3 EJECT Position Confirmation Fig J1 2 ...
Страница 26: ...5 2 4 Grounding Plate Unit Full Erase Head and Cylinder Unit Fig J2 1 ...
Страница 40: ...5 3 CASSETTE UP ASS Y SECTION 5 3 1 Top Plate Wiper Arm Unit and Holder Unit Fig K1 1 ...
Страница 86: ...10 2 MECHANISM BOTTOM SECTION ...
Страница 87: ...10 3 CASSETTE UP COMPARTMENT SECTION ...
Страница 88: ...10 4 CHASSIS FRAME AND CASING PARTS SECTION ...
Страница 89: ...10 5 PACKING PARTS AND ACCESSORIES SECTION ...
Страница 117: ...R3036 ERJ6GEYJ122V MGF CHIP 1 10W 1 2K ...
Страница 123: ...ECKATS101MB CERAMIC 20 250V 100P ...
Страница 125: ...C3021 ECUV1C224ZFV C CHIP 80 20 16V 0 22 ...