©2013 PACE Inc., Southern Pines, NC
Page 21 of 31
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14. Position the nozzle over the component with the component square to the nozzle.
a) When using Box or V-A-N nozzles, insert component body into the bottom of the nozzle.
b) When using Pattern nozzles, position component leads beneath and in line with the air
jets on the nozzle.
c) When using a Single Jet nozzle, position the component on its land
pattern (prefilled or with solder paste deposition). Solder tack lead(s) if
necessary.
NOTE:
Any required preheating operating should be completed before advancing
beyond this point.
15. Using the Vacuum Pick Adjust Control, adjust the height of the component relative to the
nozzle as desired. PACE recommends that:
a) The bottom of the nozzle should be positioned approximately 1mm
(0.040") above the PCB when using Box or Pattern nozzles.
b) BGA components are to be positioned fully into the nozzle. The walls
of the V-A-N nozzles will contact the component body.
16. Lower nozzle (with component) to a point where the component leads/contacts rest gently on
or just above the component land pattern.
NOTE:
If component has been previously positioned on land
pattern, lower any Box or Pattern nozzle to a height of
approximately 1mm (.040") above the PCB.
17. Ensure that the handpiece is held vertical to the PCB.
NOTE:
For Single Jet nozzles, hold the end of the nozzle tube above
the rework area at a height and angle which gives the best
results in your particular application.
