NCP1060, NCV1060, NCP1063, NCV1063
www.onsemi.com
31
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
1
8
16
9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PL
P
−B−
−A−
M
0.25 (0.010)
B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010)
A
S
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.80
10.00
0.386
0.393
B
3.80
4.00
0.150
0.157
C
1.35
1.75
0.054
0.068
D
0.35
0.49
0.014
0.019
F
0.40
1.25
0.016
0.049
G
1.27 BSC
0.050 BSC
J
0.19
0.25
0.008
0.009
K
0.10
0.25
0.004
0.009
M
0
7
0
7
P
5.80
6.20
0.229
0.244
R
0.25
0.50
0.010
0.019
_
_
_
_
6.40
16X
0.58
16X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
16
8
9
8X
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