Nokia 201, Руководство по обслуживанию

Страница: 125 / 158

Table of Contents
Baseband System Module ..................................................................................................................................... 5–5
Overview ........................................................................................................................................................... 5–5
Introduction: phone description .................................................................................................................... 5–5
Chipset and key components .......................................................................................................................... 5–6
BB block diagram ............................................................................................................................................. 5–7
Baseband functional description .................................................................................................................... 5–8
Baseband functional description ............................................................................................................... 5–8
System power up ........................................................................................................................................ 5–9
Modes of operation .................................................................................................................................. 5–12
Power distribution ................................................................................................................................... 5–12
Clocking concept ....................................................................................................................................... 5–14
Audio concept ........................................................................................................................................... 5–14
Baseband electrical interfaces: Battery ................................................................................................. 5–16
Baseband electrical interfaces: Charger ................................................................................................. 5–16
Baseband electrical interfaces: Display(s) ............................................................................................. 5–17
Baseband electrical interfaces: Memory ................................................................................................ 5–18
Baseband electrical interfaces: SIM ........................................................................................................ 5–19
Baseband electrical interface: Dual SIM (for RM-761 only) .................................................................. 5–20
Baseband electrical interfaces: Audio components .............................................................................. 5–21
Baseband electrical interfaces: Backlight and illumination ................................................................ 5–21
Baseband electrical interfaces: Keyboard .............................................................................................. 5–22
Baseband electrical interfaces: Camera ................................................................................................. 5–22
Baseband electrical interfaces: Memory card ........................................................................................ 5–23
Baseband electrical interfaces: Vibrator ................................................................................................ 5–23
Baseband electrical interfaces: BT module ............................................................................................ 5–24
RF System Module ............................................................................................................................................... 5–24
Overview ........................................................................................................................................................ 5–24
RF general description .................................................................................................................................. 5–24
Frequency plan .............................................................................................................................................. 5–24
Regulators and power supply concept ........................................................................................................ 5–25
RF block diagram ........................................................................................................................................... 5–26
BOM release version and RF part list ........................................................................................................... 5–28
List of Tables
Table 3 Chipset key components ......................................................................................................................... 5–6
Table 4 Quantum Frequency Plan ..................................................................................................................... 5–25
Table 5 Power supply voltages for the X-GOLD213 IC RF sub-system ........................................................... 5–25
Table 6 Schematic differences between releases ........................................................................................... 5–28
List of Figures
Figure 48 Quantum block diagram ...................................................................................................................... 5–7
Figure 49 Power up timing and system sleep ................................................................................................. 5–10
Figure 50 System startup, SW view .................................................................................................................. 5–11
Figure 51 X-GOLD213 power management unit ............................................................................................. 5–12
Figure 52 Power supply distribution ................................................................................................................ 5–13
Figure 53 XG213 clock generation and distribution ....................................................................................... 5–14
Figure 54 X-Gold213 audio output selection ................................................................................................... 5–15
Figure 55 Dual and single speaker configurations ......................................................................................... 5–15
RM-761; RM-799; RM-800
System Module
Issue 1 COMPANY CONFIDENTIAL Page 5 – 3
Copyright © 2011 Nokia. All rights reserved.