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Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet
height.
1-2. It is possible for the chip to crack by the expansion and shrinkage of a metal board. Please
contact us if you want to use our ceramic capacitors on a metal board such as Aluminum.
Pattern Forms
Placing of Leaded
Components
after Chip Component
Lateral Mounting
Notice
Prohibited
Correct
Placing Close to Chassis
Placing of Chip
Components
and Leaded Components
Chassis
Solder (ground)
Electrode Pattern
Lead Wire
Solder Resist
Solder Resist
Soldering Iron
Lead Wire
Solder Resist
Solder Resist
JEMCAC-00640B
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