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7.Printed Circuit Board Cropping

1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is 
    caused by bending or twisting the board.

 1-1. In cropping the board, the stress as shown right may cause the capacitor to crack.
        Try not to apply this type of stress to a capacitor. 

Bending

Twisting

2. Check of the cropping method for the  printed circuit board in advance.

 2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus to prevent the
        mechanical stress which can occur to the board.

    (1) Example of a suitable jig
         Recommended example: the board should be pushed as close to the near the cropping jig as possible 
         and from the back side of board in order to minimize the compressive stress applied to capacitor.
         Not recommended example* when the board is pushed at a point far from the cropping jig and from
         the front side of board  as below, the capacitor may form a crack caused by the tensile stress applied
         to capacitor.

Outline of jig

   (2) Example of a suitable machine
        An outline of a printed circuit board cropping machine is shown as follows. Along the lines with the
        V-grooves on printed circuit board, the top and bottom blades are aligned to one another when
        cropping the board.
        The misalignment of the position between top and bottom blades may cause the capacitor to crack.

Outline of machine

Principle of operation

Cross-section diagram

Top blade

Top blade

Top blade

Top blade

Bottom blade

Bottom blade

Bottom blade

Bottom blade

Caution

Recommended

Not recommended

Top-bottom misalignment

Left-right misalignment

Front-rear misalignment

Recommended

Not recommended

Printed circuit 
board

V-groove

Board cropping jig

Printed circuit board

Top blade

V-groove

Bottom blade

Load point

Direction of 
load

Components

Printed circuit 
board

Direction of 
load

Load point

Components

Printed circuit 
board

Top blade

Printed circuit board

V-groove

!

JEMCAC-00640B

16

Содержание LLA185C70G105ME01 Series

Страница 1: ...General Electronic equipment 20 55 to 125 C 22 to 22 55 to 125 C 25 C 3 Temperature Characteristics Public STD Code F EIA p Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Cha...

Страница 2: ...a Termination should occur eutectic solder Then apply 5N force in parallel with the test jig for 10 1 sec The soldering shall be done either with an iron or using the reflow method and shall be conduc...

Страница 3: ...at 150 0 10 C for one houg and then let sit D F 0 2 max for 24 2 hours at room temperature Perform the initial measurement I R 12 5 F min Measurement after test Perform a heat treatment at 150 0 10 fo...

Страница 4: ...g Code L K 2 1 Minimum Quantity pcs reel 2 2 Dimensions of Tape in mm Package LLA Type 4 0 0 1 4 0 0 1 2 0 0 1 0 2 0 1 1 7max A B 1 75 0 1 3 5 0 05 8 0 0 3 1 5 Code LLA18 LLA21 LLA31 A 1 05 0 1 1 45 0...

Страница 5: ...0 5 10 1 5 16 5 max Hole for Chip As specified in 2 2 Base Tape As specified in 2 2 Top Tape Thickness 0 06 LLA18 LLA215 LLA315 type Thickness 0 05 Feeding Hole As specified in 2 2 Fig 1 Package Chip...

Страница 6: ...no jointing for top tape and bottom tape 2 9 There are no fuzz in the cavity 2 10 Break down force of top tape 5N min 2 11 Reel is made by resin and appeaser and dimension is shown in Fig 3 There are...

Страница 7: ...ght dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wit...

Страница 8: ...itors using your actual appliances at the intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperat...

Страница 9: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Страница 10: ...s such as their aging voltage and temperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high di...

Страница 11: ...ny impact on the terminals 2 Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor Do not use a fallen capacitor because the quality and reliability m...

Страница 12: ...use capacitors that were removed from the equipment 2 Confirm capacitance characteristics under actual applied voltage 3 Confirm the mechanical stress under actual process and equipment use 4 Confirm...

Страница 13: ...nozzle so as not to bend the printed circuit board 2 Adjust the nozzle pressure within a static load of 1N to 3N during mounting Incorrect Correct 2 Dirt particles and dust accumulated between the suc...

Страница 14: ...flow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder Amount for Reflow Soldering 4 1 Overly thi...

Страница 15: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Страница 16: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...

Страница 17: ...hat can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplug...

Страница 18: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Страница 19: ...and dimensions into consideration to eliminate the possibility of excess solder fillet height 1 2 It is possible for the chip to crack by the expansion and shrinkage of a metal board Please contact us...

Страница 20: ...ons in table 1 for flow soldering table 2 for reflow soldering Please confirm the suitable land dimension by evaluating of the actual SET PCB Table 2 Reflow Soldering Method Dimensions Part Number in...

Страница 21: ...ocess The stress is affected by the amount of resin and curing contraction Select a resin with small curing contraction The difference in the thermal expansion coefficient between a coating resin or a...

Страница 22: ...way that the boxes are not deformed and forces are not directly passed on to the inner packaging 1 2 Do not apply excessive vibration shock and pressure to the capacitor 1 When excessive mechanical sh...

Страница 23: ...ation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if your...

Страница 24: ...GJ2D051515SC 82224C 82473C GCJ31CR71H105KA12L GRM2165C1H101FA01D GRM55D7U3A103JW31L PTGL09AS2R2K3B51B0 11R683C 1217AS H 1R5N P3 DD1274AS H 220M P3 1447440C BPM15 120 Q12P C NMK1212SC NMV1212DAC NXFT15...

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