2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of PCB
bending / etc if the land area is larger than needed and has an excess
amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 2 Reflow Soldering Method
Dimensions
Part Number
(in mm)
Notice
Chip
（
L×W
）
0.5～0.7
0.35～0.6
0.2～0.3
0.5
LLA18
p
0.7～0.9
0.4～0.7
0.3～0.4
a
b
c
0.8
0.4
LLA21
2.0×1.25
1.6×0.8
0.3～0.4
0.25～0.35
0.15～0.25
LLA31
3.2×1.6
Chip Capacitor
Land
JEMCAC-00640B
20
