MEIG SLM758, Руководство по конструкции аппаратуры

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MeiG Smart product technical information
SLM758
Hardware Design Guide
Page 6
6. Electrical, Reliability ............................................................................................................................................. 67
6.1 Absolute Maximum ...................................................................................................................................... 67
6.2 Working Temperature ................................................................................................................................. 67
6.3 Working Voltage .......................................................................................................................................... 67
6.4 Digital Interface Features ............................................................................................................................ 67
6.5 SIM_VDD Characteristics .......................................................................................................................... 68
6.6 PWRKEY Feature ....................................................................................................................................... 68
6.7 VCOIN Feature ............................................................................................................................................ 68
6.8 Current Consumption (VBAT = 3.8V) ....................................................................................................... 68
6.9 Electrostatic Protection ............................................................................................................................... 69
6.10 Module Operating Frequency Band ......................................................................................................... 69
6.11 RF Characteristics ..................................................................................................................................... 71
6.12 Module Conduction Receiving Sensitivity ............................................................................................... 71
6.13 WIFI Main RF Performance .................................................................................................................... 72
6.14 BT Main RF Prformance .......................................................................................................................... 73
6.15 GNSS Main RF Performance ................................................................................................................... 73
7. Production .............................................................................................................................................................. 74
7.1. Top And Bottom Views Of The Module ................................................................................................... 74
7.2. Recommended Soldering Furnace Temperature Curve ......................................................................... 74
7.3. Humidity Sensitivity (MSL) ....................................................................................................................... 74
7.4. Baking Requirements ................................................................................................................................. 75
8. Support Peripheral Device List ............................................................................................................................ 76
9. Appendix ................................................................................................................................................................ 78
9.1. Related Documents ..................................................................................................................................... 78
9.2. Terms And Explanations ............................................................................................................................ 78
9.3. Multiplexing function ................................................................................................................................. 80
9.4. Safety Warning ........................................................................................................................................... 81
10. OEM/Integrators Installation Manual ....................................................................................................... 81
10.1.Important Notice to OEM integrators ............................................................................................. 81
10.2.End Product Labeling ........................................................................................................................ 82
10.3.Manual Information to the End User ............................................................................................... 82
10.4.Federal Communication Commission Interference Statement ...................................................... 83
10.5.Industry Canada Statement .............................................................................................................. 83
10.6.Radiation Exposure Statement ......................................................................................................... 84