MeiG Smart product technical information
SLM758
Hardware Design Guide
Page 74
7. Production
7.1. Top And Bottom Views Of The Module
Figure 48: Module top and bottom views
7.2. Recommended Soldering Furnace Temperature Curve
Figure 49: Module recommended soldering furnace temperature curve
7.3. Humidity Sensitivity (MSL)
The SLM758 module meets moisture sensitivity level 3. The dry package is subjected to
the J-STD-020C specification in accordance with the IPC/JEDEC standard under ambient
conditions of temperature <30 degrees and relative humidity <60%. Under ambient