MeiG Smart product technical information
SLM758
Hardware Design Guide
Page 52
2. We recommend that the headphone detection pin HS_DET and HPH_L form a detection
circuit (the connection method in the above figure), because HPH_L has a pull-down resistor
inside the chip, which can ensure that HS_DET is low when connected with HPH_L, if the user
will HS_DET and HPH_R To connect, please reserve a 1K pull-down resistor on HPH_R.
3 The standard of the headphone interface is the European standard OMPT. If you need to design
the American standard CTIA interface, you need to swap the GND and MIC signals for the
network. If you want to be compatible with both headset standards, you need an external
dedicated chip, such as the TI-TS3A226AE.
4.9.4.Speaker Interface Circuit
The module integrates a Class-D audio amplifier with an output power of 0.85W and an
output signal of SPKR_OUT_P / SPKR_OUT_M.
图
4.24
:用内部音频功放推荐电路
It is also possible to add an audio amplifier externally, using CDC_HPH_R as a single-ended
input signal, and the reference circuit is shown below.
Figure 4.25
:
Recommended circuit with external audio amplifier