MeiG Smart product technical information
SLM758
Hardware Design Guide
Page 8
1.
Introduction
This document describes the hardware application interface of the module, including the
connection of the circuit and the RF interface.It can help users quickly understand the interface
definition, electrical performance, and structural dimensions of the module.Combining this
document with other application documents, users can quickly use modules to design mobile
communication applications.
2.
Module overview
SLM758 series core board, uses the MSM8953 of Qualcomm Snapdragon 600 series for its
main chip, and its CPU is made of 14nm FinFET, built in 64bit ARM, 8 cores Cortex A-53,
main frequency 2.0G processor, supporting LPDDR3 SDRAM memory.
Supporting board memory of 16GB/32GB global different mode multi-mode LTE intelligent
communication module.This module is suitable for broadband intelligent wireless
communication modules of TD-LTE/FDD-LTE/WCDMA/EVDO/TD-SCDMA/CDMA/GSM
network standards.
The working frequency band supported by SLM758 module is:
FDD-LTE: B2/4/5/7/12/13/17/28b
WCDMA: B2/4/5
