Package
Copyright © 2008 Marvell
Doc. No. MV-S104859-U0 Rev. E
December 2, 2008, Preliminary
Document Classification: Proprietary Information
Page 131
Table 73: HSBGA 288-pin Package Dimensions
S y m b o l
C o m m o n D i m e n s i o n
( i n m i l l i m e t e r s )
Package
HSBGA
Body size
X
D
19.000
Y
E
19.000
Ball pitch
X
eD
1.000
Y
eE
1.000
Total thickness
A
1.910 ± 0.190
Mold thickness
A3
0.850 ref
Substrate thickness
A2
0.560 ref
Ball diameter
0.600
Standoff
A1
0.400 ~ 0.600
Ball width
b
0.500 ~ 0.700
Mold area
X
M
17.000
Y
N
17.000
H/S exposed size
P
12.000 ~ 13.200
H/S flatness
Q
0.100
H/S shift with substrate edge
R
0.300
H/S shift with mold area
S
0.500
Chamfer
CA
1.215 ref
Package edge tolerance
aaa
0.200
Substrate flatness
bbb
0.250
Mold flatness
ccc
0.350
Copolarity
ddd
0.200
Ball offset (package)
eee
0.250
Ball offset (ball)
fff
0.100
Ball count
n
288
Edge ball center-to-center
X
D1
17.000
Y
E1
17.000
Содержание Integrated Controller 88F6281
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