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TIWI TRANSCEIVER MODULES
USER’S GUIDE
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LSEVK-WP-01-A2-UG
Copyright © 2010 LS Research, LLC Page 2 of 35
Table of Contents
1 Introduction ..................................................................................................................... 3
1.1 Purpose & Scope ....................................................................................................................... 3
1.2 Audience .................................................................................................................................... 3
1.3 Applicable Documents ............................................................................................................... 3
1.4 Revision History ......................................................................................................................... 3
2 Quick Start ....................................................................................................................... 4
2.1 Software ..................................................................................................................................... 4
2.2 Hardware ................................................................................................................................... 8
2.3 WLAN Test Software Operation .............................................................................................. 12
2.4 Evaluation Board Schematics and Bill of Material ................................................................... 30
3 EMC Compliance Application Guide ........................................................................... 31
3.1 Introduction .............................................................................................................................. 31
3.2 Module Integration Considerations – Antenna Systems ......................................................... 31
3.3 Module Integration Considerations – Circuit Implementation .................................................. 31
3.4 Module Integration Considerations - Top Assembly Considerations. ..................................... 32
3.5 Module Integration Considerations – Firmware ....................................................................... 32
3.6 Testing Requirements for End-Product ................................................................................... 32
3.7 Marking Requirements for End-Product. ................................................................................. 32
4 Contacting LS Research ............................................................................................... 35