Linear Technology Analog Devices LT8708-1, Техническое описание

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LT8708-1
35
Rev 0
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
PACKAGE DESCRIPTION
5.00 ± 0.10
PIN 1
TOP MARK
1 33
22 22
33
14
21
21 15
15
BOTTOM VIEW—EXPOSED PAD
3.10
±
0.10
0.675
REF
0.55
REF
5.85
±
0.10
0.75 TYP
× 4
8.00
±
0.10
R = 0.125
TYP
(UHG) QFN 0417 REV A
1.00 TYP
1.00 TYP
0.20 REF
DETAIL A
0.40 ± 0.05
0.25 ± 0.05
0.50 BSC
0.00 – 0.05
0.75 ± 0.05
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES IN DEGREES.
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
COPLANARITY SHALL NOT EXCEED 0.08MM.
3. WARPAGE SHALL NOT EXCEED 0.10MM.
4. PACKAGE LENGTH / PACKAGE WIDTH ARE CONSIDERED AS SPECIAL CHARACTERISTIC(S).
5. REFER JEDEC M0-220.
C 0.35
UHG Package
40-Lead Plastic QFN (5mm
×
8mm)
(Reference LTC DWG # 05-08-1528 Rev A)
40 34
0.203 +0.058, –0.008
TERMINAL THICKNESS
DETAIL A
0.00 – 0.05
0.203
±
0.008
DETAIL B
DETAIL B
0.08 REF
0.31 REF
3.10 ± 0.10
5.85 ± 0.10
0.70 ± 0.05
6.50 REF
3.50 REF
4.10 ± 0.05
5.50 ± 0.05
7.10 ± 0.05
0.25 ± 0.05
8.50
±
0.05
PACKAGE
OUTLINE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED