Kontron cPCI-MXS64GX, Техническое справочное руководство

Страница: 12 / 135

iv
3.3. Customizing the Board...................................................................................................3.15
3.3.1. Processor and Fan ............................................................................................3.15
3.3.2. Backup Battery..................................................................................................3.16
3.3.3. Memory .............................................................................................................3.17
3.3.3.1. SDRAM System Memory.....................................................................3.17
3.3.3.2. DIMM Installation.................................................................................3.18
3.3.4. Supervision Features ........................................................................................3.19
3.3.4.1. Power Fail Monitoring..........................................................................3.19
3.3.4.2. Watchdog ............................................................................................3.20
3.3.4.3. Thermal Management .........................................................................3.22
3.4. Building a CPCI System.................................................................................................3.23
3.4.1. Backplane .........................................................................................................3.24
3.4.2. Rear-Panel I/O ..................................................................................................3.25
3.4.3. Storage Devices ................................................................................................3.27
3.4.4. Power Supply ....................................................................................................3.27
3.4.5. Fan Tray............................................................................................................3.27
3.4.6. Installing the Board into a Bay ...........................................................................3.27
3.4.7. Connector Keying..............................................................................................3.28
3.4.8. Bus Mastering ...................................................................................................3.29
3.4.9. Connection ........................................................................................................3.29