Keba D3-DA 3 Series, Руководство по проектированию устройства

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D3-DA 3xx/x Mounting and installation instructions
Project engineering manual V1.07
38
© KEBA
Caution
Please ensure that there are no particles of dirt between the cooler and the
rear wall of the device during mounting. If this instruction is not followed, the
device will overheat due to the poor thermal transfer. The device may fail as
a result.
The D3-DA 3xx/x is now mounted and ready for cabling (see chap. "Connec-
tions and wiring").
Sizing the cooler
D3-DA 3xx/x size BG1 D3-DA 3xx/x size BG2
Thermal resistance R
th
K
1)
0.02 K/W 0.01 K/W
Thermal capacity of the cool-
ing plate on the device
390 Ws/K 780 Ws/K
Max. temperature cooling
plate Device
85 °C
Surface of the cooler
2)
max. roughness R
Z
= 6,3
1)
Thermal resistance between active cooling surface on the device and
cooler.
2)
In this case the cooled rear panel for mounting the module is called as
cooler.
5.3.2.1 Sizing the cooler
D3-DA 3xx/x size BG1 D3-DA 3xx/x size BG2
Thermal resistance R
th
K
1)
0.02 K/W 0.01 K/W
Thermal capacity of the cool-
ing plate on the device
390 Ws/K 780 Ws/K
Max. temperature cooling
plate Device
85 °C
Surface of the cooler
2)
max. roughness R
Z
= 6.3
1)
Thermal resistance between active cooling surface on the device and
cooler.
2)
In this case the cooled rear panel for mounting the module is called as
cooler.
5.4 Dismantling of the module
During the disassembly of the module it needs to be ensured and checked
that it is absolutely de-energized (see chap. "Power supply").