Intel Xeon E5-2400, Термомеханическое конструкторское руководство

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Thermal Solutions
34 Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
Table 5-1 and Table 5-2 specify
Ψ
CA
and pressure drop targets for specific airflows. To
determine
Ψ
CA
and pressure drop targets for other airflows, use Best-fit equations in
Figure 5-1 . Heatsink detailed drawings are in Appendix A .
Ψ
CA
2
0.273
o
C/W 0.265
o
C/W 0.264
o
C/W 0.278
o
C/W
0.265
o
C/W (8-core),
0.269
o
C/W (6-core)
Airflow
3
13 CFM @ 0.32” dP
System height
(form factor)
4
1U (CEB)
Heatsink
volumetric
5
90 x 90 x 25.5 mm (1U/SSI blade)
6
Heatsink
technology
7
Cu base, Al fins
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter ( Section 5.4.1 ).
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in
inches H
2
O.
4. Reference system configuration. Processor is downstream from processor in CEB (Compact
Electronics Bay). With the values above, the 25.5mm tall heatsink can meet the processor thermal
specifications in Intel's Reference Design 10.5x12 inches CEB board. However, these CEB values are
not used to generate processor thermal specifications. Ducting is utilized to direct airflow.
5. Dimensions of heatsink do not include socket or processor.
6. Heatsink socket/processor height ( Table 4-2 ) complies with TEB 1U Rack Height
Constraints (36 mm) in EEB Specification 2011, and with Maximum Component Height (33.5 mm)
in SSI Compute Blade Specification, both at http://www.ssiforum.org.
7. Passive heatsinks. PCM45F thermal interface material.
Table 5-2. Performance Expectations in Compact Electronics Bay (CEB)
Parameter Value
Figure 5-1. Best-fit Equations