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Intel® Xeon® Processor E5-2400 Product Family

41

Thermal/Mechanical Design Guide

Thermal Solutions

5.8

DTS Based Thermal Specification

5.8.1

Compliance to Tcase Based Thermal Profile

Processor heatsink design must still comply with the Tcase based thermal profile 
provided in the 

Intel® Xeon® Processor E5-2400 Product Family Datasheet - Volume 

One

. Heatsink design compliance can be determined with thermocouple and TTV as 

with previous processors.

The heat sink is sized to comply with the Tcase based thermal profile. Customers have 
an option to either follow processor based Tcase spec or follow the DTS based thermal 
specification. In some situations, implementation of DTS based thermal specification 
can reduce average fan power and improve acoustics as compared to the Tcase based 
thermal profile. 

When all cores are active, a properly sized heatsink will be able to meet the DTS based 
thermal specification. When all cores are not active or when Intel Turbo Boost 
Technology is active, attempting to comply with the DTS based thermal specification 
may drive system fans to maximum speed. In such situations, the T

CASE

 temperature 

will be below the T

CASE

 based thermal profile by design.

5.8.2

Considerations for Follow-on Processor

The follow-on processor in the platform will have new capabilities as compared to the 
Intel® Xeon® Processor E5-2400 Product Family. For example, the follow-on processor 
has a new Package Configuration Space (PCS) command to read margin (M) from the 
processor: RdPkgConfig(), Index 10. For the Intel® Xeon® Processor E5-2400 Product 
Family, margin (M) must be calculated in firmware. 

In the following sections, implementation details specified for the Intel® Xeon® 
Processor E5-2400 Product Family can also be used for the follow-on processor.

For more information regarding the differences between the follow-on processor and 
the Intel® Xeon® Processor E5-2400 Product Family see 

Platform Digital Thermal 

Sensor (DTS) Based Thermal Specifications and Overview

.

5.8.3

DTS Based Thermal Profile, Tcontrol and Margin for the 

Intel® Xeon® Processor E5-2400 Product Family

The calculation of the DTS based thermal specification is based on both Tcontrol and 
the DTS Based Thermal Profile (T

DTS

):

T

DTS

 = min[T

LA

 + 

Ψ

pa

 * P * F, TEMPERATURE_TARGET [23:16] – Tcc_Offset]

Where T

LA

 + 

Ψ

pa

 are the intercept and slope terms from the T

DTS

 equations in the 

appropriate External Design Specification (EDS).

 

To implement the DTS based thermal 

specification, these equations must be programmed in firmware. Since the equations 
differ with processor SKU, SKUs can be identified by TDP, Core Count and a profile 
identifier (CSR bits). For associated commands, see 

Platform Digital Thermal Sensor 

(DTS) Based Thermal Specifications and Overview. 

Power (P) is calculated in 

Section 5.8.4

. As power dynamically changes, the 

specification also changes, so power and T

DTS

 calculations are recommended every 1 

second. 

Correction factor (F) compensates for the error in power monitoring. The current 
estimate for F is 0.95. 

Содержание Xeon E5-2400

Страница 1: ...Reference Number 327250 001 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide May 2012 ...

Страница 2: ...future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The Intel Xeon E5 2400 Product Family may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Requires a system with Intel Turbo Boost Technology I...

Страница 3: ... 3 Durability 24 3 2 Assembly of ILM to a Motherboard 25 3 3 ILM Cover 27 4 LGA1356 Socket ILM and Back Plate Electrical Mechanical and Environmental Specifications29 4 1 Component Mass 29 4 2 Package Socket Stackup Height 29 4 3 Socket Maximum Temperature 29 4 4 Loading Specifications 30 4 5 Electrical Requirements 30 4 6 Environmental Requirements 31 5 Thermal Solutions 33 5 1 Boundary Condition...

Страница 4: ...2 Intel Collaboration Thermal Solution 47 A 1 3 Alternative Thermal Solution 48 A 1 4 Socket ILM and Back Plate 50 B Mechanical Drawings 51 C Socket Mechanical Drawings 85 D Processor Installation Tool 91 E Embedded Thermal Solutions 93 E 1 Performance Targets 93 E 2 Thermal Design Guidelines 94 E 2 1 High Case Temperature Thermal Profile 94 E 3 Mechanical Drawings and Supplier Information 95 Figu...

Страница 5: ...M Sheet 1 of 2 74 B 24 2U Reference Heatsink Assembly with TIM Sheet 2 of 2 75 B 25 Tower Reference Heatsink Assembly with TIM Sheet 1 of 2 76 B 26 Tower Reference Heatsink Assembly with TIM Sheet 2 of 2 77 B 27 25 5 mm Reference Heatsink Assembly Sheet 1 of 2 78 B 28 25 5 mm Reference Heatsink Assembly Sheet 2 of 2 79 B 29 25 5 mm Reference Heatsink Fin and Base Sheet 1 of 2 80 B 30 25 5 mm Refer...

Страница 6: ...Intel Reference Thermal Solution 47 A 2 Suppliers for the Intel Collaboration Thermal Solution 48 A 3 Suppliers for the Alternative Thermal Solution 48 A 4 LGA1356 Socket ILM and Back Plate 50 B 1 Mechanical Drawing List 51 C 1 Mechanical Drawing List 85 E 1 8 Core 6 Core Processor Reference Thermal Boundary Conditions 93 E 2 4 Core Processor Reference Thermal Boundary Conditions 93 E 3 Embedded H...

Страница 7: ...Intel Xeon Processor E5 2400 Product Family 7 Thermal Mechanical Design Guide Revision History Document Number Revision Number Description Date 327250 001 Initial release of the document May 2012 ...

Страница 8: ...8 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...

Страница 9: ...sor E5 2400 Product Family Datasheet Volume One The components described in this document include The processor thermal solution heatsink and associated retention hardware The LGA1356 socket the Independent Loading Mechanism ILM and back plate The goals of this document are To assist board and system thermal mechanical designers To assist designers and suppliers of processor heatsinks Thermal prof...

Страница 10: ...it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature FSC Fan Speed Control IHS Integrated Heat Spreader a component of the processor package used to enhance the thermal performance of the package Component thermal solutions interface with the p...

Страница 11: ... Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature Thermal Profile Line that defines the temperature specification of a processor at a given power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids and ...

Страница 12: ...Introduction 12 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...

Страница 13: ...th lead free solder balls for surface mounting on the motherboard The socket has 1356 contacts with 1 016 mm X 1 016 mm pitch X by Y in a 43x41 grid array with 21x17 grid depopulation in the center of the array and selective depopulation elsewhere The socket must be compatible with the package processor and the Independent Loading Mechanism ILM The design includes a back plate which is a key contr...

Страница 14: ...LGA1356 Socket 14 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure 2 2 LGA1356 Socket Contact Numbering Top View of Socket ...

Страница 15: ...6 mm and board pitch 40 mil as these values are equivalent In general metal defined MD pads perform better than solder mask defined SMD pads under thermal cycling and SMD pads perform better than MD pads under dynamic stress At this time complete recommendations for pad definition and pad size do not exist for the LGA1356 socket See Section 2 9 for more information on pad definition and pad size F...

Страница 16: ...ivalent with UL 94 V 0 flame rating capable of withstanding 260 C for 40 seconds typical reflow rework The socket coefficient of thermal expansion in the XY plane and creep properties must be such that the integrity of the socket is maintained for the conditions listed in the LGA1366 Socket Validation Reports and the LGA1356 Addendum The color of the housing will be dark as compared to the solder ...

Страница 17: ...conds typical reflow rework profile and the conditions listed in the LGA1366 Socket Validation Reports and LGA1356 Addendum without degrading Reports are available from socket suppliers listed in Appendix A As indicated in Figure 2 5 the Pick and Place cover remains on the socket during ILM installation Use of the ILM cover can mitigate against bent socket contacts associated with reinstalling the...

Страница 18: ... posts to physically prevent mis orientation of the package These orientation features also provide initial rough alignment of package to socket As shown in Figure 2 7 the package substrate has a 2 mark near the orientation notch on the Pin 1 side Similarly space has been reserved for a 2 mark on the motherboard in the Board Keepin Keepout Zones in Figure B 1 and Figure B 2 These matching marks he...

Страница 19: ...The max chain contact resistance from Table 4 4 must be met when mated in the 1st and 30th cycles The socket Pick and Place cover must withstand 15 cycles of insertion and removal 2 6 Markings There are three markings on the socket LGA1356 Font type is Helvetica Bold minimum 6 point 2 125 mm Manufacturer s insignia font size at supplier s discretion Lot identification code allows traceability of m...

Страница 20: ...ce thermal mechanical components 2 9 LGA1356 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non critical to function NCTF for post environmental testing The processor signals at NCTF locations are typically redundant ground or non critical reserved so the loss of the solder joint continuity at end of life conditions will not affect the overall product functiona...

Страница 21: ...Intel Xeon Processor E5 2400 Product Family 21 Thermal Mechanical Design Guide LGA1356 Socket Figure 2 8 LGA1356 NCTF Solder Joints ...

Страница 22: ...LGA1356 Socket 22 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...

Страница 23: ...eference ILM Custom non Intel ILM designs do not benefit from Intel s detailed studies and may not incorporate critical design parameters 3 1 Design Concept The ILM and back plate are assemblies and can be procured from the enabled vendors 3 1 1 ILM Assembly Design Overview The ILM assembly consists of four major pieces load lever load plate frame and the captive fasteners The load lever and load ...

Страница 24: ...llow access to test points and backside capacitors An additional cut out on two sides provides clearance for backside voltage regulator components An insulator is pre applied To stay within the temperature limit of the insulator remove the back plate prior to board component rework 3 1 3 Durability The ILM durability requirement is 30 processor cycles 1 processor cycle install processor close load...

Страница 25: ... designed to nest over the Pick and Place cover This feature helps prevent reinstallation of the Pick and Place cover a step that can lead to socket bent contacts To prevent the ILM cover from popping off during ILM assembly the load plate can be unlatched from the load lever when the fasteners are torqued as shown is Step 3 Using a T20 Torx driver fasten the ILM assembly to the back plate with th...

Страница 26: ...mal Mechanical Design Guide Figure 3 3 ILM Assembly ILM cover Step 1 With socket body reflowed on board and back plate in fixture align board holes to back plate studs Step 2 With back plate against bottom of board align ILM assembly to back plate studs ILM cover Pick and Place Cover Step3 Step4 Step5 ...

Страница 27: ...e components and pre assembled to the ILM load plate The ILM cover will interfere with a processor and pop off if the ILM is closed with a processor in the socket The ILM cover is designed to be interchangeable between different suppliers validated by Intel Performance of the pop off feature may decline if the ILM cover supplier is different than the ILM supplier The ILM cover can be removed manua...

Страница 28: ...Independent Loading Mechanism ILM and Back Plate 28 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...

Страница 29: ... seating plane to the top of the IHS and accounting for its nominal variation and tolerances that are given in the corresponding processor EDS and expected values for the follow on processor 2 This value is a RSS calculation 4 3 Socket Maximum Temperature The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance To ensure socket long term...

Страница 30: ...56 socket 4 This minimum limit defines the compressive force required to electrically seat the processor onto the socket contacts 5 Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement 6 Test condition used a heatsink mass of 550 gm 1 21 lb with 50 g acceleration measured at heatsink mass The dynamic portion of this specification in the product a...

Страница 31: ...uctor These values must be satisfied at the worst case height of the socket Maximum mutual capacitance C 1 pF The capacitance between two contacts Socket Average Contact Resistance EOL 15 2 mΩ The socket average contact resistance target is derived from average of every chain contact resistance for each part used in testing with a chain contact resistance defined as the resistance of each chain mi...

Страница 32: ...om technology itj q32000 pdf reliability pdf Figure 4 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the market expected use environment for the technology Develop Speculative stress conditions based on historical data content experts and literature search Perform stressing to validate accelerated stressing assumptions and determine acceleration factors Freeze stressi...

Страница 33: ...0 296oC W 8 core 0 298oC W 6 core 0 285oC W TLA 2 2 Local ambient temperature of the air entering the heatsink 49oC 48 1oC Airflow3 3 Airflow through the heatsink fins with zero bypass Max target for pressure drop dP measured in inches H2O 9 7 CFM 0 23 dP 13 CFM 0 28 dP System height form factor 1U EEB 4 4 Reference system configuration Processor is downstream from memory in EEB Entry Level Electr...

Страница 34: ...gh the heatsink fins with zero bypass Max target for pressure drop dP measured in inches H2O 4 Reference system configuration Processor is downstream from processor in CEB Compact Electronics Bay With the values above the 25 5mm tall heatsink can meet the processor thermal specifications in Intel s Reference Design 10 5x12 inches CEB board However these CEB values are not used to generate processo...

Страница 35: ...aptive screws to 8 inch pounds Fastener sequencing in other words starting the threads on all four screws before torquing may mitigate against cross threading This assembly process is designed to produce a static load of 39 51 lbf for 0 062 0 100 board thickness respectively Honeywell PCM45F is expected to meet the performance targets in Table 5 1 and Table 5 2 from 30 60 lbf From Table 4 3 the He...

Страница 36: ...ket solder ball stress Customers need to assess shock for their designs as their heatsink retention back plate heatsink mass and chassis mounting holes may vary 5 4 Thermal Design 5 4 1 Thermal Characterization Parameter The case to local ambient Thermal Characterization Parameter ΨCA is defined by Equation 5 1 ΨCA TCASE TLA TDP Where TCASE Processor case temperature C For TCASE specification see ...

Страница 37: ...implement need based fan speed control The placement of system sensors in cooling zones where each zone has dedicated fan s can improve the ability to tune fan speed control for optimal performance and or acoustics System events such as fan or power supply failure device events such as TCC Activation or THERMTRIP and maintenance events such as hot swap time allowance need to be comprehended to imp...

Страница 38: ...lue As such temperature readings over short time intervals may vary considerably using this MSR For this reason DTS obtained thru PECI GetTemp may be preferred since temperature filtering will provide the thermal trend 5 6 1 2 Tcontrol Relief Factory configured TCONTROL values are available in the appropriate Dear Customer Letter or may be extracted by issuing a Mailbox or an RDMSR instruction See...

Страница 39: ...ustics and wall power 5 6 2 Short Duration TCC Activation and Catastrophic Thermal Management for Intel Xeon Processor E5 2400 Product Family Systems designed to meet thermal capacity may encounter short durations of throttling also known as TCC activation especially when running non steady processor stress applications This is acceptable and is functionally within the intended temperature control...

Страница 40: ...xpected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit TCC activation initially occurred Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation then data integrity is not assured At some higher threshold THERMTRIP_N...

Страница 41: ...ow on processor has a new Package Configuration Space PCS command to read margin M from the processor RdPkgConfig Index 10 For the Intel Xeon Processor E5 2400 Product Family margin M must be calculated in firmware In the following sections implementation details specified for the Intel Xeon Processor E5 2400 Product Family can also be used for the follow on processor For more information regardin...

Страница 42: ...onfig Temperature Target Read 23 16 DTS the relative temperature from thermal control circuit activation is negative by definition and changes instantaneously DTS command info is given in Section 5 6 1 1 5 8 4 Power Calculation for the Intel Xeon Processor E5 2400 Product Family To implement DTS based thermal specification average power over time must be calculated P E2 E1 t2 t1 Where t1 time stam...

Страница 43: ...processor SKU Customers should tune these coefficients based on their thermal solutions 5 8 6 Capabilities for the Follow on Processor For the follow on processor the intercept and slope terms from the TDTS equations TLA Ψpa as defined in Section 5 8 3 are stored in the processor This allows margin M to be reported by the processor The PECI command for margin M will be RdPkgConfig Index 10 M 0 gap...

Страница 44: ...Thermal Solutions 44 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...

Страница 45: ...re also used in board functional tests to assess performance for specific conditions 6 2 1 Board Functional Test Sequence Each test sequence should start with components baseboard heatsink assembly and so on that have not been previously submitted to any reliability testing The test sequence should always start with a visual inspection after assembly and BIOS Processor memory test The stress test ...

Страница 46: ...istant to fungal growth Examples of non resistant materials include cellulose materials animal and vegetable based adhesives grease oils and many hydrocarbons Synthetic materials such as PVC formulations certain polyurethane compositions for example polyester and some polyethers plastics which contain organic fillers of laminating materials paints and varnishes also are susceptible to fungal growt...

Страница 47: ...ntel reference thermal solutions from the suppliers listed in Table A 1 A 1 2 Intel Collaboration Thermal Solution Customers can purchase the Intel collaboration thermal solutions from the suppliers listed in Table A 2 Table A 1 Suppliers for the Intel Reference Thermal Solution Assembly Component Description Supplier PN Supplier Contact Info Assembly Heat Sink Intel Xeon processor E5 2400 product...

Страница 48: ...ssembly Heatsink Intel Xeon processor E5 2400 product family Pedestal Tower URS Heatsink Intel Collaboration Heatsink p n E32412 001 Supplier Designed Solution with Intel specified retention includes TIM up to 95W capable Chaun Choung Technology Corp CCI pn 0007029401 Chaun Choung Technology Corp CCI Monica Chih monica_chih ccic com tw 886 2 2995 2666 x1131 Sean Wu sean_wu ccic com tw 408 768 7629...

Страница 49: ...lta Electronics DHS B9090 20 www deltaww com up to 95W capable Performance Celsia Technologies 01IN001 www celsiatechnologies com up to 95W capable Assembly Heatsink 2U 2U Alternative URS Heatsink Standard Asia Vital Components SR40400001 www avc com tw up to 95W capable Standard Asia Vital Components SR41400002 www avc com tw up to 95W capable Standard Thermaltake CL P0486 www Thermaltake com up ...

Страница 50: ...A www Taisol com up to 95W capable Standard Thermaltake CL P0485 www Thermaltake com up to 95W capable Standard Asia Vital Components SS40W00001 www avc com tw up to 95W capable Assembly Heatsink Pedestal 2U Active Heatsink Active Dynatron Corporation Top Motor Dynaeon G555 www Dynatron Corp com up to 95W capable Table A 3 Suppliers for the Alternative Thermal Solution Sheet 3 of 3 Assembly Compon...

Страница 51: ...Heatsink Volumetric Sheet 1 of 2 Figure B 15 2U Collaborative Heatsink Volumetric Sheet 2 of 2 Figure B 16 Tower Collaborative Heatsink Assembly Sheet 1 of 2 Figure B 17 Tower Collaborative Heatsink Assembly Sheet 2 of 2 Figure B 18 Tower Collaborative Heatsink Volumetric Sheet 1 of 2 Figure B 19 Tower Collaborative Heatsink Volumetric Sheet 2 of 2 Figure B 20 1U Reference Heatsink Assembly with T...

Страница 52: ... TO SOCKET BALL ARRAY IS FORMED BY INTERSECTION OF ROW A COLUMN 1 MAXIMUM OUTLINE OF SOCKET SOLDERBALL ARRAY MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN INNER PATTERN FOR PROPER ILM SOCKET FUNCTION 5 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT DEFINED BY THAT ZONE ALL ZONES DEFI...

Страница 53: ...197 85 00 3 346 2X 80 00 3 150 3X 80 00 3 150 9 32 90 1 295 9 35 90 1 413 9 3 60 0 142 9 6 60 0 260 E91486 2 02 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 2 OF 4 DO NOT SCALE DRAWING SCALE 3 000 E...

Страница 54: ...00 1 850 E91486 3 02 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 3 OF 4 DO NOT SCALE DRAWING SCALE 3 000 EASD PTMI 02 E91486 D REV DRAWING NUMBER SIZE DEPARTMENT AS VIEWED FROM SECONDARY SIDE OF TH...

Страница 55: ...INDICATOR FOR B2 SOCKET CONFIG 11 09 10 E91486 4 02 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 4 OF 4 DO NOT SCALE DRAWING SCALE 2 500 EASD PTMI 02 E91486 D REV DRAWING NUMBER SIZE DEPARTMENT ALL ...

Страница 56: ...Mechanical Drawings 56 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 ...

Страница 57: ...Intel Xeon Processor E5 2400 Product Family 57 Thermal Mechanical Design Guide Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 ...

Страница 58: ...Mechanical Drawings 58 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 7 1U Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 59: ...Intel Xeon Processor E5 2400 Product Family 59 Thermal Mechanical Design Guide Mechanical Drawings Figure B 8 1U Reference Heatsink Fin and Base Sheet 2 of 2 ...

Страница 60: ...6 03 UPDATED SHAFT INSPECTION CRITERIA ADDED NOTE 7 ADDED SHOULDER NOTE 09 08 08 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION 5 MAJOR DIA M3 x 0 5 TOLERANCE CLASS 6G 2 93 0 06 0 115 0 002 7 00 0 276 6 00 0 236 5 7 3 90 ...

Страница 61: ...Intel Xeon Processor E5 2400 Product Family 61 Thermal Mechanical Design Guide Mechanical Drawings Figure B 10 Heatsink Compression Spring 1U 2U and Tower ...

Страница 62: ...Mechanical Drawings 62 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 11 Heatsink Retaining Ring 1U 2U and Tower ...

Страница 63: ...Intel Xeon Processor E5 2400 Product Family 63 Thermal Mechanical Design Guide Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower ...

Страница 64: ...Mechanical Drawings 64 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 13 2U Collaborative Heatsink Assembly Sheet 1 of 2 ...

Страница 65: ...Intel Xeon Processor E5 2400 Product Family 65 Thermal Mechanical Design Guide Mechanical Drawings Figure B 14 2U Collaborative Heatsink Assembly Sheet 2 of 2 ...

Страница 66: ...Mechanical Drawings 66 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 15 2U Collaborative Heatsink Volumetric Sheet 1 of 2 ...

Страница 67: ...Intel Xeon Processor E5 2400 Product Family 67 Thermal Mechanical Design Guide Mechanical Drawings Figure B 16 2U Collaborative Heatsink Volumetric Sheet 2 of 2 ...

Страница 68: ...Mechanical Drawings 68 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 17 Tower Collaborative Heatsink Assembly Sheet 1 of 2 ...

Страница 69: ...Intel Xeon Processor E5 2400 Product Family 69 Thermal Mechanical Design Guide Mechanical Drawings Figure B 18 Tower Collaborative Heatsink Assembly Sheet 2 of 2 ...

Страница 70: ...Mechanical Drawings 70 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 19 Tower Collaborative Heatsink Volumetric Sheet 1 of 2 ...

Страница 71: ...Intel Xeon Processor E5 2400 Product Family 71 Thermal Mechanical Design Guide Mechanical Drawings Figure B 20 Tower Collaborative Heatsink Volumetric Sheet 2 of 2 ...

Страница 72: ...ED 01 PRODUCTION RELEASE 12 14 07 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION NOTES 1 THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE ...

Страница 73: ... 1 08 0 01 27 5 0 5 1 08 0 01 E32409 2 01 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 1 500 EASD PTMI 01 E32409 D REV DRAWING NUMBER SIZE DEPARTMENT THERMAL INTERF...

Страница 74: ...D 01 PRODUCTION RELEASE 12 14 07 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION NOTES 1 THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE O...

Страница 75: ... 1 08 0 01 27 5 0 5 1 08 0 01 E32410 2 01 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 1 500 EASD PTMI 01 E32410 D REV DRAWING NUMBER SIZE DEPARTMENT THERMAL INTERF...

Страница 76: ...TION DATE APPROVED 01 PRODUCTION RELEASE 12 14 07 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION NOTES 1 THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING ...

Страница 77: ... 5 1 08 0 01 27 5 0 5 1 08 0 01 E32412 2 01 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 1 500 EASD PTMI 01 E32412 D REV DRAWING NUMBER SIZE DEPARTMENT THERMAL INTE...

Страница 78: ...Mechanical Drawings 78 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 27 25 5 mm Reference Heatsink Assembly Sheet 1 of 2 ...

Страница 79: ...Intel Xeon Processor E5 2400 Product Family 79 Thermal Mechanical Design Guide Mechanical Drawings Figure B 28 25 5 mm Reference Heatsink Assembly Sheet 2 of 2 ...

Страница 80: ...Mechanical Drawings 80 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 29 25 5 mm Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 81: ...Intel Xeon Processor E5 2400 Product Family 81 Thermal Mechanical Design Guide Mechanical Drawings Figure B 30 25 5 mm Reference Heatsink Fin and Base Sheet 2 of 2 ...

Страница 82: ...Mechanical Drawings 82 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure B 31 25 5 mm Reference Heatsink Assembly with TIM Sheet 1 of 2 ...

Страница 83: ...Intel Xeon Processor E5 2400 Product Family 83 Thermal Mechanical Design Guide Mechanical Drawings Figure B 32 25 5 mm Reference Heatsink Assembly with TIM Sheet 2 of 2 ...

Страница 84: ...Mechanical Drawings 84 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...

Страница 85: ...s Table C 1 lists the mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing Sheet 2 of 4 Figure C 2 Socket Mechanical Drawing Sheet 3 of 4 Figure C 3 Socket Mechanical Drawing Sheet 4 of 4 Figure C 4 ...

Страница 86: ...Socket Mechanical Drawings 86 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure C 1 Socket Mechanical Drawing Sheet 1 of 4 ...

Страница 87: ...Intel Xeon Processor E5 2400 Product Family 87 Thermal Mechanical Design Guide Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4 ...

Страница 88: ...Socket Mechanical Drawings 88 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure C 3 Socket Mechanical Drawing Sheet 3 of 4 ...

Страница 89: ...Intel Xeon Processor E5 2400 Product Family 89 Thermal Mechanical Design Guide Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4 ...

Страница 90: ...Socket Mechanical Drawings 90 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...

Страница 91: ...ocessor Installation Tool D Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal Contact the supplier for details regarding this tool Billy Hsieh billy hsieh tycoelectronics com 81 44 844 8292 ...

Страница 92: ...Processor Installation Tool 92 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure D 1 Processor Installation Tool ...

Страница 93: ... guidance for heatsink design Notes 1 Local ambient temperature of the air entering the heatsink 2 Max target mean 3 sigma offset for thermal characterization parameter Section 5 4 1 3 Dimensions of heatsink do not include socket or processor 4 Local Ambient Temperature written X Yo C means Xo C under Nominal conditions but Yo C is allowed for Short Term NEBS excursions 5 All heatsinks are Non Dir...

Страница 94: ... thermal profile are specified in the Intel Xeon Processor E5 2400 Product Family Datasheet Volume One High case temperature thermal profiles help relieve thermal constraints for Short Term NEBS conditions To help reliability processors must meet the nominal thermal profile under standard operating conditions and can only rise up to the Short Term spec for NEBS excursions see Figure E 2 The defini...

Страница 95: ...echanical Drawings and Supplier Information See Appendix B for retention and keep out drawings The part number below represent Intel reference designs for a ATCA reference heatsink Customer implementation of these components may be unique and require validation by the customer Customers can obtain these components directly from the supplier below Figure E 2 NEBS Thermal Profile Thermal Profile 40 ...

Страница 96: ...ign Guide Table E 4 Mechanical Drawings List Parameter Value ATCA Reference Heat Sink Assembly Sheet 1 of 2 Figure E 3 ATCA Reference Heat Sink Assembly Sheet 2 of 2 Figure E 4 ATCA Reference Heatsink Fin and Base Sheet 1 of 2 Figure E 5 ATCA Reference Heatsink Fin and Base Sheet 2 of 2 Figure E 6 ...

Страница 97: ...Intel Xeon Processor E5 2400 Product Family 97 Thermal Mechanical Design Guide Embedded Thermal Solutions Figure E 3 ATCA Reference Heat Sink Assembly Sheet 1 of 2 ...

Страница 98: ...Embedded Thermal Solutions 98 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure E 4 ATCA Reference Heat Sink Assembly Sheet 2 of 2 ...

Страница 99: ...Intel Xeon Processor E5 2400 Product Family 99 Thermal Mechanical Design Guide Embedded Thermal Solutions Figure E 5 ATCA Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 100: ...Embedded Thermal Solutions 100 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide Figure E 6 ATCA Reference Heatsink Fin and Base Sheet 2 of 2 ...

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