LGA1356 Socket, ILM and Back Plate Electrical, Mechanical, and Environmental Specifications
30
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
4.4
Loading Specifications
The socket will be tested against the conditions listed in the LGA1366 Socket Validation
Reports, and LGA1356 Addendum, with heatsink, ILM and back plate attached, under
the loading conditions outlined in this chapter.
provides load specifications for the LGA1356 socket with the ILM and back
plate installed. The maximum limits should not be exceeded during heatsink assembly,
shipping conditions, or standard use condition. Exceeding these limits during test may
result in component failure. The socket body should not be used as a mechanical
reference or load-bearing surface for thermal solutions.
Notes:
1.
These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2.
This is the minimum and maximum static force that can be applied by the heatsink and it’s retention
solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated
to these limits. TIM load range is documented in
for the Intel Reference Design.
3.
Loading limits are for the LGA1356 socket.
4.
This minimum limit defines the compressive force required to electrically seat the processor onto the socket
contacts.
5.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
6.
Test condition used a heatsink mass of 550 gm [1.21 lb] with 50 g acceleration measured at heatsink mass.
The dynamic portion of this specification in the product application can have flexibility in specific values, but
the ultimate product of mass times acceleration should not exceed this dynamic load.
4.5
Electrical Requirements
LGA1356 socket electrical requirements are measured from the socket-seating plane of
the processor to the component side of the socket PCB to which it is attached. All
specifications are maximum values (unless otherwise stated) for a single socket
contact, but includes effects of adjacent contacts where indicated.
Table 4-3.
Socket and ILM Mechanical Specifications
Parameter
Min
Max
Notes
Static compressive load from ILM to processor
IHS
445 N [100 lbf]
623 N [140 lbf]
,
Thermal Solution Static Compressive Load
0 N [0 lbf]
266 N [60 lbf]
,
Total Static Compressive Load
(ILM plus Heatsink)
445 N (100 lbf)
890 N (200 lbf)
,
Dynamic Compressive Load
(with heatsink installed)
N/A
890 N [200 lbf]
,
Target Pick and Place Cover allowable removal
force
N/A
4.45 - 6.68 N [1.0 -
1.5 lbf]
Load Lever actuation force
N/A
38.3 N [8.6 lbf] in the
vertical direction
10.2 N [2.3 lbf] in the
lateral direction.
Содержание Xeon E5-2400
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Страница 12: ...Introduction 12 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Страница 22: ...LGA1356 Socket 22 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Страница 44: ...Thermal Solutions 44 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Страница 84: ...Mechanical Drawings 84 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
Страница 90: ...Socket Mechanical Drawings 90 Intel Xeon Processor E5 2400 Product Family Thermal Mechanical Design Guide ...
