Thermal/Mechanical Design Guide
89
Embedded Thermal Solutions
Notes:
1.) The thermal specifications shown in this graph are for reference only. See the Intel® Xeon® Processor 5500
Series Datasheet, Volume 1 for the Thermal Profile specifications. In case of conflict, the data in the datasheet
supersedes any data in this figure.
2.) The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
3.) The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 360 hours per year as compliant with NEBS Level 3.
4.) Implementation of either thermal profile should result in virtually no TCC activation.
5.) Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the Short-
Term Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processor
thermal specifications and may result in permanent damage to the processor.
E.2.2
Custom Heat Sinks For UP ATCA
The Embedded specific 60W SKU is targeted for NEBS compliant 1U+ systems and UP
ATCA configurations with custom thermal solutions. In order to cool this part in a single
wide ATCA slot, a custom thermal solution will be required. Since solutions like this will
be very configuration specific, this heat sink was not fully designed with retention and
keep-out definitions.
In order to cool the additional power of a 60W processor in ATCA, the heat sink volume
was increased. The assumption was that the heat sink could not grow wider because of
VR and Memory placement, so a Remote Heat Exchanger (RHE) was used. The RHE is
attached to the main heat sink with a heat pipe. The RHE gives additional convective
surface area and gives the thermal solution access to more air. Samples of the
following design were ordered and tested for thermal performance only.
Flotherm analysis shows that the following design can cool an LGA1366 TTV in an ATCA
blade at 30CFM. The heat sink
Ψ
ca would be 0.50C/W at 55C ambient which falls below
the thermal profile for the 60W processor.
Figure E-2. NEBS Thermal Profile
\
Thermal Profile
40
50
60
70
80
90
0
5
10
15
20
25
30
35
40
45
50
55
60
Power [W]
T
case [
C
]
Short-Term Thermal Profile
Tc = 0.302 * P + 66.9
Nominal Thermal Profile
Tc = 0.302* P + 51.9
Short-term Thermal Profile may only be used for short term
excursions to higher ambient temperatures, not to exceed 360
hours per year
Содержание Xeon 5500 Series
Страница 8: ...8 Thermal Mechanical Design Guide ...
Страница 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Страница 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Страница 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Страница 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Страница 56: ...Mechanical Drawings 56 Thermal Mechanical Design Guide Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 ...
Страница 57: ...Thermal Mechanical Design Guide 57 Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 ...
Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 10 Heatsink Compression Spring 1U 2U and Tower ...
Страница 62: ...Mechanical Drawings 62 Thermal Mechanical Design Guide Figure B 11 Heatsink Retaining Ring 1U 2U and Tower ...
Страница 63: ...Thermal Mechanical Design Guide 63 Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower ...
Страница 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Страница 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
Страница 91: ...Thermal Mechanical Design Guide 91 Embedded Thermal Solutions Figure E 5 UP ATCA Heat Sink Drawing ...
Страница 98: ...Processor Installation Tool 98 Thermal Mechanical Design Guide Figure F 1 Processor Installation Tool ...
