Thermal/Mechanical Design Guide
41
Thermal Solutions
compliance by ensuring that the processor Tcase value, as measured on the TTV, does
not exceed Tcase_max_B at the anomalous power level for the environmental condition
of interest. This anomalous power level is equal to 75% of the TDP limit.
5.7.2
Thermal Excursion Power for 80 W Processor
Under fan failure or other anomalous thermal excursions, Tcase may exceed the
thermal profile for a duration totaling less than 360 hours per year without affecting
long term reliability (life) of the processor. For more typical thermal excursions,
Thermal Monitor is expected to control the processor power level as long as conditions
do not allow the Tcase to exceed the temperature at which Thermal Control Circuit
(TCC) activation initially occurred. Under more severe anomalous thermal excursions
when the processor temperature cannot be controlled at or below this Tcase level by
TCC activation, then data integrity is not assured. At some higher threshold,
THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to
the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal
excursion compliance by ensuring that the processor Tcase value, as measured on the
TTV, does not exceed Tcase_max at the anomalous power level for the environmental
condition of interest. This anomalous power level is equal to 75% of the TDP limit.
5.7.3
Absolute Processor Temperature
Intel does not test any third party software that reports absolute processor
temperature. As such, Intel cannot recommend the use of software that claims this
capability. Since there is part-to-part variation in the TCC (thermal control circuit)
activation temperature, use of software that reports absolute temperature can be
misleading.
See the
Intel® Xeon® Processor 5500 Series Datasheet, Volume 1
for details
regarding use of IA32_TEMPERATURE_TARGET register to determine the minimum
absolute temperature at which the TCC will be activated and PROCHOT# will be
asserted.
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Содержание Xeon 5500 Series
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Страница 56: ...Mechanical Drawings 56 Thermal Mechanical Design Guide Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 ...
Страница 57: ...Thermal Mechanical Design Guide 57 Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 ...
Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 10 Heatsink Compression Spring 1U 2U and Tower ...
Страница 62: ...Mechanical Drawings 62 Thermal Mechanical Design Guide Figure B 11 Heatsink Retaining Ring 1U 2U and Tower ...
Страница 63: ...Thermal Mechanical Design Guide 63 Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower ...
Страница 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Страница 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
Страница 91: ...Thermal Mechanical Design Guide 91 Embedded Thermal Solutions Figure E 5 UP ATCA Heat Sink Drawing ...
Страница 98: ...Processor Installation Tool 98 Thermal Mechanical Design Guide Figure F 1 Processor Installation Tool ...
