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Thermal/Mechanical Design Guide

Contents

Introduction

..............................................................................................................9

1.1

References ....................................................................................................... 10

1.2

Definition of Terms ............................................................................................ 10

LGA1366 Socket

...................................................................................................... 13

2.1

Board Layout .................................................................................................... 15

2.2

Attachment to Motherboard ................................................................................ 16

2.3

Socket Components........................................................................................... 16
2.3.1

Socket Body Housing .............................................................................. 16

2.3.2

Solder Balls ........................................................................................... 16

2.3.3

Contacts ............................................................................................... 17

2.3.4

Pick and Place Cover............................................................................... 17

2.4

Package Installation / Removal ........................................................................... 18
2.4.1

Socket Standoffs and Package Seating Plane.............................................. 18

2.5

Durability ......................................................................................................... 19

2.6

Markings .......................................................................................................... 19

2.7

Component Insertion Forces ............................................................................... 19

2.8

Socket Size ...................................................................................................... 19

2.9

LGA1366 Socket NCTF Solder Joints..................................................................... 20

Independent Loading Mechanism (ILM)

................................................................... 21

3.1

Design Concept................................................................................................. 21
3.1.1

ILM Cover Assembly Design Overview ....................................................... 21

3.1.2

ILM Back Plate Design Overview............................................................... 22

3.2

Assembly of ILM to a Motherboard....................................................................... 23

LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications

. 27

4.1

Component Mass............................................................................................... 27

4.2

Package/Socket Stackup Height .......................................................................... 27

4.3

Socket Maximum Temperature............................................................................ 27

4.4

Loading Specifications........................................................................................ 28

4.5

Electrical Requirements...................................................................................... 28

4.6

Environmental Requirements .............................................................................. 29

Thermal Solutions

................................................................................................... 31

5.1

Performance Targets.......................................................................................... 31
5.1.1

25.5 mm Tall Heatsink ............................................................................ 33

5.2

Heat Pipe Considerations.................................................................................... 34

5.3

Assembly ......................................................................................................... 35
5.3.1

Thermal Interface Material (TIM) .............................................................. 36

5.4

Structural Considerations ................................................................................... 36

5.5

Thermal Design................................................................................................. 36
5.5.1

Thermal Characterization Parameter ......................................................... 36

5.5.2

Dual Thermal Profile ............................................................................... 37

5.6

Thermal Features .............................................................................................. 38
5.6.1

Fan Speed Control.................................................................................. 39

5.6.2

PECI Averaging and Catastrophic Thermal Management............................... 40

5.6.3

Intel® Turbo Boost Technology ................................................................ 40

5.7

Thermal Guidance ............................................................................................. 40
5.7.1

Thermal Excursion Power for 95 W Processor ............................................. 40

5.7.2

Thermal Excursion Power for 80 W Processor ............................................. 41

5.7.3

Absolute Processor Temperature .............................................................. 41

Содержание Xeon 5500 Series

Страница 1: ...Document Number 321323 001 Intel Xeon Processor 5500 Series Thermal Mechanical Design Guide March 2009 ...

Страница 2: ... which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Intel processor numbers are not a measure of performance Processor numbers differentiate features within each processor family not across differ...

Страница 3: ...rboard 23 4 LGA1366 Socket and ILM Electrical Mechanical and Environmental Specifications 27 4 1 Component Mass 27 4 2 Package Socket Stackup Height 27 4 3 Socket Maximum Temperature 27 4 4 Loading Specifications 28 4 5 Electrical Requirements 28 4 6 Environmental Requirements 29 5 Thermal Solutions 31 5 1 Performance Targets 31 5 1 1 25 5 mm Tall Heatsink 33 5 2 Heat Pipe Considerations 34 5 3 As...

Страница 4: ... 97 Figures 1 1 Intel Xeon 5500 Platform Socket Stack 9 2 1 LGA1366 Socket with Pick and Place Cover Removed 13 2 2 LGA1366 Socket Contact Numbering Top View of Socket 14 2 3 LGA1366 Socket Land Pattern Top View of Board 15 2 4 Attachment to Motherboard 16 2 5 Pick and Place Cover 17 2 6 Package Installation Removal Features 18 2 7 LGA1366 NCTF Solder Joints 20 3 1 ILM Cover Assembly 22 3 2 Back P...

Страница 5: ...Heatsink Assembly with TIM Sheet 1 of 2 72 B 221U Reference Heatsink Assembly with TIM Sheet 2 of 2 73 B 232U Reference Heatsink Assembly with TIM Sheet 1 of 2 74 B 242U Reference Heatsink Assembly with TIM Sheet 2 of 2 75 B 25Tower Reference Heatsink Assembly with TIM Sheet 1 of 2 76 B 26Tower Reference Heatsink Assembly with TIM Sheet 2 of 2 77 C 1 Socket Mechanical Drawing Sheet 1 of 4 80 C 2 S...

Страница 6: ... 25 5 mm Tall Heatsink 33 5 3 Fan Speed Control TCONTROL and DTS Relationship 39 5 4 TCONTROL Guidance 39 6 1 Heatsink Test Conditions and Qualification Criteria 43 A 1 Suppliers for the Intel Reference Thermal Solution 47 A 2 Suppliers for the Intel Collaboration Thermal Solution 48 A 3 Suppliers for the Alternative Thermal Solution 48 A 4 LGA1366 Socket and ILM Components 49 B 1 Mechanical Drawi...

Страница 7: ...Thermal Mechanical Design Guide 7 Revision History Document Number Revision Number Description Revision Date 321323 001 Public Release March 2009 ...

Страница 8: ...8 Thermal Mechanical Design Guide ...

Страница 9: ... expected to change as they mature The components described in this document include The processor thermal solution heatsink and associated retention hardware The LGA1366 socket and the Independent Loading Mechanism ILM and back plate Processors in 1 socket Workstation platforms are covered in the Intel Xeon Processor 3500 Series Thermal Mechanical Design Guide The goals of this document are To as...

Страница 10: ...e package Component thermal solutions interface with the processor at the IHS surface ILM Independent Loading Mechanism provides the force needed to seat the 1366 LGA land package onto the socket contacts LGA1366 socket The processor mates with the system board through this surface mount 1366 contact socket PECI The Platform Environment Control Interface PECI is a one wire interface that provides ...

Страница 11: ...iven power level TIM Thermal Interface Material The thermally conductive compound between the heatsink and the processor case This material fills the air gaps and voids and enhances the transfer of the heat from the processor case to the heatsink TLA The measured ambient temperature locally surrounding the processor The ambient temperature should be measured just upstream of a passive heatsink or ...

Страница 12: ...Introduction 12 Thermal Mechanical Design Guide ...

Страница 13: ...unting on the motherboard The socket has 1366 contacts with 1 016 mm X 1 016 mm pitch X by Y in a 43x41 grid array with 21x17 grid depopulation in the center of the array and selective depopulation elsewhere The socket must be compatible with the package processor and the Independent Loading Mechanism ILM The design includes a back plate which is integral to having a uniform load on the socket sol...

Страница 14: ... 7 5 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 ...

Страница 15: ...6 Socket Land Pattern Top View of Board A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 2 8 4 6 10 16 12 14 18 24 20 22 26 32 28 30 2 8 4 6 10 16 12 14 18 24 20 22 26 32 28 30 16 12 15 13 14 17 18 24 20 19 23 21 22 25 26 32 28 27 31 29 30 33 34 40 36 35 39 37...

Страница 16: ...ng 260 C for 40 seconds typical reflow rework The socket coefficient of thermal expansion in the XY plane and creep properties must be such that the integrity of the socket is maintained for the conditions listed in the LGA1366 Socket Validation Reports The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems 2 3 2 Solde...

Страница 17: ...ocket during reflow to help prevent contamination during reflow The cover can withstand 260 C for 40 seconds typical reflow rework profile and the conditions listed in the LGA1366 Socket Validation Reports without degrading As indicated in Figure 2 5 the cover remains on the socket during ILM installation and should remain on whenever possible to help prevent damage to the socket contacts Cover re...

Страница 18: ...rough alignment of package to socket The socket has alignment walls at the four corners to provide final alignment of the package See Appendix F for information regarding a tool designed to provide mechanical assistance during processor installation and removal 2 4 1 Socket Standoffs and Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after sold...

Страница 19: ...for 40 seconds typical reflow rework profile without degrading and must be visible after the socket is mounted on the motherboard LGA1366 and the manufacturer s insignia are molded or laser marked on the side wall 2 7 Component Insertion Forces Any actuation must meet or exceed SEMI S8 95 Safety Guidelines for Ergonomics Human Factors Engineering of Semiconductor Manufacturing Equipment example Ta...

Страница 20: ...y Figure 2 7 identifies the NCTF solder joints Note For platforms supporting the DP processor land C3 is CTF Figure 2 7 LGA1366 NCTF Solder Joints A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 1 3 7 5 9 11 15 13 17 19 23 21 25 27 31 29 2 8 4 6 10 16 12 14 18 24 20 22 26 32 28 30 2 8 4 6 10 16 12 14 ...

Страница 21: ...dies and may not incorporate critical design parameters 3 1 Design Concept The ILM consists of two assemblies that will be procured as a set from the enabled vendors These two components are ILM cover assembly and back plate 3 1 1 ILM Cover Assembly Design Overview The ILM Cover assembly consists of four major pieces load lever load plate frame and the captive fasteners The load lever and load pla...

Страница 22: ... back plate to the motherboard for proper assembly of the ILM around the socket A clearance hole is located at the center of the plate to allow access to test points and backside capacitors An additional cut out on two sides provides clearance for backside voltage regulator components An insulator is pre applied Back plates for processors in 1 socket Workstation platforms are covered in the Intel ...

Страница 23: ...threaded studs In step 2 the ILM cover assembly is placed over the socket and threaded studs Using a T20 Torx driver fasten the ILM cover assembly to the back plate with the four captive fasteners Torque to 8 2 inch pounds The length of the threaded studs accommodate board thicknesses from 0 062 to 0 100 Figure 3 2 Back Plate Threaded studs Threaded nuts Clearance hole C u t o u t Threaded studs T...

Страница 24: ... plate in fixture align board holes to back plate studs Step 2 With back plate against bottom of board align ILM cover assembly to back plate studs Step 1 With socket body reflowed on board and back plate in fixture align board holes to back plate studs Step 2 With back plate against bottom of board align ILM cover assembly to back plate studs ...

Страница 25: ...dicated in Figure 3 4 socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assembly with respect to the socket The result is a specific Pin 1 orientation with respect to the ILM lever Figure 3 4 Pin1 and ILM Lever Protrusion ILM Lever Pin 1 ILM Key ...

Страница 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...

Страница 27: ...e IHS and accounting for its nominal variation and tolerances that are given in the corresponding processor EMTS 2 This value is a RSS calculation 4 3 Socket Maximum Temperature The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance To ensure socket long term reliability Intel defines socket maximum temperature using a via on the under...

Страница 28: ...rically seat the processor onto the socket contacts 5 Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement 6 Test condition used a heatsink mass of 550 gm 1 21 lb with 50 g acceleration measured at heatsink mass The dynamic portion of this specification in the product application can have flexibility in specific values but the ultimate product of...

Страница 29: ...ductance L NA The inductance on a contact due to any single neighboring contact Maximum mutual capacitance C 1 pF The capacitance between two contacts Socket Average Contact Resistance EOL 15 2 mΩ The socket average contact resistance target is derived from average of every chain contact resistance for each part used in testing with a chain contact resistance defined as the resistance of each chai...

Страница 30: ... reliability pdf Figure 4 1 Flow Chart of Knowledge Based Reliability Evaluation Methodology Establish the market expected use environment for the technology Develop Speculative stress conditions based on historical data content experts and literature search Perform stressing to validate accelerated stressing assumptions and determine acceleration factors Freeze stressing requirements and perform ...

Страница 31: ...lso meet Profile B for the 95W processor in TEB Thin Electronics Bay under the following conditions TLA 40ºC ΨCA 0 275ºC W airflow 16 CFM 0 344 dP these TEB values are not used to generate processor thermal specifications Processor is not downstream from memory in TEB Ducting is utilized to direct airflow 6 Dimensions of heatsink do not include socket or processor 7 The 2U heatsink height 64mm soc...

Страница 32: ...he 1U heatsink versus the airflow provided Best fit equations are provided to prevent errors associated with reading the graph For 2U and Tower heatsink see Appendix B for volumetric drawings Table 5 1 specifies ΨCA and pressure drop targets at 30 CFM At airflows other than 30 CFM ΨCA and pressure drop will differ between suppliers as their heatpipe and fin geometries will vary Figure 5 1 1U Heats...

Страница 33: ...SI blade and EEB Entry Level Electronics Bay not in TEB Thin Electronics Bay Ducting is utilized to direct airflow 5 Dimensions of heatsink do not include socket or processor The 25 5 mm heatsink height socket processor height 7 729 mm Table 4 2 complies with 33 5mm max height for SSI blade boards http ssiforum oaktree com 6 Passive heatsinks Dow Corning TC 1996 thermal interface material Table 5 ...

Страница 34: ...ition of the TTV die The TTV die is sized and positioned similarly to the processor die Figure 5 2 TTV Die Size and Orientation Figure 1 Side Views of Package with IHS not to scale Core 1 Core 2 Core 3 Core 4 Cache Cache Cache Cache Uncore Core Cache 42 5 45 19 3 13 2 1 0 Package CL Die CL NOT TO SCALE All Dimensions in mm ...

Страница 35: ... 0 100 board thickness respectively Honeywell PCM45F is expected to meet the performance targets in Table 5 1 from 30 60 lbf From Table 4 3 the Heatsink Static Compressive Load of 0 60 lbf allows for designs that vary from the 1U reference heatsink Example A customer s unique heatsink with very little static load as little as 0 lbf is acceptable from a socket loading perspective as long as the TCA...

Страница 36: ...during shock Placement of board to chassis mounting holes also impacts board deflection and resultant socket solder ball stress Customers need to assess shock for their designs as their heatsink retention back plate heatsink mass and chassis mounting holes may vary 5 5 Thermal Design 5 5 1 Thermal Characterization Parameter The case to local ambient Thermal Characterization Parameter ΨCA is define...

Страница 37: ...CC activation risk For heatsinks that comply to Profile B yet do not comply to Profile A 1U heatsink in Figure 5 5 the processor has an increased probability of TCC activation and an associated measurable performance loss Measurable performance loss is defined to be any degradation in processor performance greater than 1 5 1 5 is chosen as the baseline since run to run variation in a performance b...

Страница 38: ... A worst case real world application is a commercially available useful application which dissipates power above TDP for a thermally relevant timeframe One example of a worst case thermal condition is when the processor local ambient temperature is above the y axis intercept for Profile A 5 6 Thermal Features More information regarding processor thermal features is contained in the appropriate Dat...

Страница 39: ...ided in the table below Implementation of TCONTROL Guidance above maintains Intel standards of reliability based on modeling of the Intel Reference Design Implementation of TCONTROL of 1 may increase risk of throttling Thermal Control Circuit activation Increased TCC activation may or may not result in measurable performance loss Thermal Profile still applies If PECI TCONTROL Guidance then the cas...

Страница 40: ...cy may provide more Intel TBT benefit on TDP limited applications as compared to lower ΨCA as temperature is not typically the limiter for these workloads With Intel TBT enabled the processor may run more consistently at higher power levels but still within TDP and be more likely to operate above TCONTROL as compared to when Intel TBT is disabled This may result in higher acoustics With Intel TBT ...

Страница 41: ... this Tcase level by TCC activation then data integrity is not assured At some higher threshold THERMTRIP will enable a shut down in an attempt to prevent permanent damage to the processor Thermal Test Vehicle TTV may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value as measured on the TTV does not exceed Tcase_max at the anomalous power level for t...

Страница 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...

Страница 43: ...ue in Table 5 1 Pressure drop not to exceed value in Table 5 1 15 3 Board Level UnPackaged Vibration 5 Hz 0 01 g2 Hz to 20 Hz 0 02 g2 Hz slope up 20 Hz to 500 Hz 0 02 g2 Hz flat Input acceleration is 3 13 g RMS 10 minutes axis for all 3 axes on all samples Random control limit tolerance is 3 dB No damage to heatsink base or pipe No visual defects As verified in wind tunnel Mean ΨCA 2 54s offset no...

Страница 44: ...sink assembly 25C to 100C for 500 cycles Cycle time is 30 minutes per full cycle divided into half cycle in hot zone and half in cold zone with minimum 1min soak at each temperature extreme for each cycle See Figure 6 1 for example profile As verified in wind tunnel Mean ΨCA 3s offset not to exceed value in Table 5 1 Pressure drop not to exceed value in Table 5 1 15 10 Heat Pipe Burst Continuously...

Страница 45: ...ir use conditions Intel reference components are also used in board functional tests to assess performance for specific conditions 6 2 1 Board Functional Test Sequence Each test sequence should start with components baseboard heatsink assembly and so on that have not been previously submitted to any reliability testing The test sequence should always start with a visual inspection after assembly a...

Страница 46: ...ts The pass criterion is that the system under test shall successfully complete the checking of BIOS basic processor functions and memory without any errors 6 3 Material and Recycling Requirements Material shall be resistant to fungal growth Examples of non resistant materials include cellulose materials animal and vegetable based adhesives grease oils and many hydrocarbons Synthetic materials suc...

Страница 47: ...ermal solutions has been verified to meet the criteria outlined in Table 6 1 Customers can purchase the Intel reference thermal solutions from the suppliers listed in Table A 1 A 1 2 Intel Collaboration Thermal Solution The Intel collaboration thermal solutions are preliminary and may not be verified to meet the criteria outlined in Table 6 1 Customers can purchase the Intel collaboration thermal ...

Страница 48: ... Choung Technology Corp CCI pn 0007029401 Chaun Choung Technology Corp CCI Monica Chih monica_chih ccic com tw 886 2 2995 2666 x1131 Harry Lin hlinack aol com 714 739 5797 Table A 3 Suppliers for the Alternative Thermal Solution Assembly Component Description Supplier PN Supplier Contact Info Assembly Heat Sink 1U 1U SSI Blade Alternative URS Heatsink Supplier Designed Solution Cu base Al fins 95W...

Страница 49: ...ludes TIM 95W capable TaiSol Corporation 1A0 9041000960 A TaiSol Corporation Janice Chiu janice chiu taisol com tw 886 2 2656 3658 Supplier Designed Solution Aluminum Extrusion includes TIM 80W capable Dynatron Corporation G520 Dynatron Corporation Ian Lee ian dynatron corp com 510 498 8888 x137 Assembly Heatsink Intel Xeon Processor 5500 Series Tower Tower Alternative URS Heatsink Supplier Design...

Страница 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...

Страница 51: ...Load Cup 1U 2U and Tower Figure B 12 2U Collaborative Heatsink Assembly Sheet 1 of 2 Figure B 13 2U Collaborative Heatsink Assembly Sheet 2 of 2 Figure B 14 2U Collaborative Heatsink Volumetric Sheet 1 of 2 Figure B 15 2U Collaborative Heatsink Volumetric Sheet 2 of 2 Figure B 16 Tower Collaborative Heatsink Assembly Sheet 1 of 2 Figure B 17 Tower Collaborative Heatsink Assembly Sheet 2 of 2 Figur...

Страница 52: ...RANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE 2 PRIMARY DIMENSIONS STATED IN MILLIMETERS BRACKATED DIMENSIONS STATED IN INCHES 3 SOCKET KEEP OUT DIMENSIONS SHOWN FOR REFERNCE ONLY PLEASE REFER TO THE SOCKET B KEEPOUT KEEPIN DRAWING FOR EXACT DIMENSIONS 4 BALL 1 LOCATION WITH RESPECT TO SOCKET BALL ARRAY IS FORMED BY INTERSECTION OF ROW A COLUMN 1 MAXIMUM OUTLINE OF SOCKET SOLDERBALL AR...

Страница 53: ...4 85 00 3 346 5 00 0 197 5 00 0 197 85 00 3 346 2X 80 00 3 150 3X 80 00 3 150 D77712 2 02 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 2 OF 4 DO NOT SCALE DRAWING SCALE 3 000 EASD PTMI 02 D77712 D R...

Страница 54: ... 20 2 843 47 00 1 850 D77712 3 02 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 3 OF 4 DO NOT SCALE DRAWING SCALE 3 000 EASD PTMI 02 D77712 D REV DRAWING NUMBER SIZE DEPARTMENT AS VIEWED FROM SECONDA...

Страница 55: ...SITION ADDED TOPSIDE CU PAD CALLOUT FOR ILM HOLES SEE DETAIL A SHEET 2 01 19 07 1C6 2D6 I REVERTED SOCKET SOLDERBALL ARRAY X DIRECTION SIZE AND POSITION TO REV G 40 64 41 66 ARRAY WIDTH 19 67 19 17 ARRAY POSITION SOLDERBALL ARRAY OUTLINE REPRESENTS THE CENTERLINE OF THE OUTER BALL ROWS COLS 01 22 07 SHT 4 SHT 4 SHT 3 SHT 1 J ADDED ISO VIEW OF SECONDARY SIDE MOVED ISO VEWS TO SHEET 4 MODIFIED BACKS...

Страница 56: ...Mechanical Drawings 56 Thermal Mechanical Design Guide Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 ...

Страница 57: ...Thermal Mechanical Design Guide 57 Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 ...

Страница 58: ...Mechanical Drawings 58 Thermal Mechanical Design Guide Figure B 7 1U Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 59: ...Thermal Mechanical Design Guide 59 Mechanical Drawings Figure B 8 1U Reference Heatsink Fin and Base Sheet 2 of 2 ...

Страница 60: ...PECTION CRITERIA ADDED NOTE 7 ADDED SHOULDER NOTE 09 08 08 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION 5 MAJOR DIA M3 x 0 5 TOLERANCE CLASS 6G 2 93 0 06 0 115 0 002 7 00 0 276 6 00 0 236 5 7 3 90 0 0 10 0 154 0 000 0 0...

Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 10 Heatsink Compression Spring 1U 2U and Tower ...

Страница 62: ...Mechanical Drawings 62 Thermal Mechanical Design Guide Figure B 11 Heatsink Retaining Ring 1U 2U and Tower ...

Страница 63: ...Thermal Mechanical Design Guide 63 Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower ...

Страница 64: ...Mechanical Drawings 64 Thermal Mechanical Design Guide Figure B 13 2U Collaborative Heatsink Assembly Sheet 1 of 2 ...

Страница 65: ...Thermal Mechanical Design Guide 65 Mechanical Drawings Figure B 14 2U Collaborative Heatsink Assembly Sheet 2 of 2 ...

Страница 66: ...Mechanical Drawings 66 Thermal Mechanical Design Guide Figure B 15 2U Collaborative Heatsink Volumetric Sheet 1 of 2 ...

Страница 67: ...Thermal Mechanical Design Guide 67 Mechanical Drawings Figure B 16 2U Collaborative Heatsink Volumetric Sheet 2 of 2 ...

Страница 68: ...Mechanical Drawings 68 Thermal Mechanical Design Guide Figure B 17 Tower Collaborative Heatsink Assembly Sheet 1 of 2 ...

Страница 69: ...Thermal Mechanical Design Guide 69 Mechanical Drawings Figure B 18 Tower Collaborative Heatsink Assembly Sheet 2 of 2 ...

Страница 70: ...Mechanical Drawings 70 Thermal Mechanical Design Guide Figure B 19 Tower Collaborative Heatsink Volumetric Sheet 1 of 2 ...

Страница 71: ...Thermal Mechanical Design Guide 71 Mechanical Drawings Figure B 20 Tower Collaborative Heatsink Volumetric Sheet 2 of 2 ...

Страница 72: ...SE 12 14 07 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION NOTES 1 THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE 2 P...

Страница 73: ...08 0 01 E32409 2 01 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 1 500 EASD PTMI 01 E32409 D REV DRAWING NUMBER SIZE DEPARTMENT THERMAL INTERFACE APPLICATION PROTEC...

Страница 74: ...E 12 14 07 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION NOTES 1 THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE 2 PR...

Страница 75: ...08 0 01 E32410 2 01 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 1 500 EASD PTMI 01 E32410 D REV DRAWING NUMBER SIZE DEPARTMENT THERMAL INTERFACE APPLICATION PROTEC...

Страница 76: ...PRODUCTION RELEASE 12 14 07 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION NOTES 1 THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER S...

Страница 77: ...1 08 0 01 E32412 2 01 DWG NO SHT REV THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION SHEET 2 OF 2 DO NOT SCALE DRAWING SCALE 1 500 EASD PTMI 01 E32412 D REV DRAWING NUMBER SIZE DEPARTMENT THERMAL INTERFACE APPLICATION PROT...

Страница 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...

Страница 79: ...mechanical drawings included in this appendix Table C 1 Mechanical Drawing List Drawing Description Figure Number Socket Mechanical Drawing Sheet 1 of 4 Figure C 1 Socket Mechanical Drawing Sheet 2 of 4 Figure C 2 Socket Mechanical Drawing Sheet 3 of 4 Figure C 3 Socket Mechanical Drawing Sheet 4 of 4 Figure C 4 ...

Страница 80: ...Socket Mechanical Drawings 80 Thermal Mechanical Design Guide Figure C 1 Socket Mechanical Drawing Sheet 1 of 4 ...

Страница 81: ...Thermal Mechanical Design Guide 81 Socket Mechanical Drawings Figure C 2 Socket Mechanical Drawing Sheet 2 of 4 ...

Страница 82: ...Socket Mechanical Drawings 82 Thermal Mechanical Design Guide Figure C 3 Socket Mechanical Drawing Sheet 3 of 4 ...

Страница 83: ...Thermal Mechanical Design Guide 83 Socket Mechanical Drawings Figure C 4 Socket Mechanical Drawing Sheet 4 of 4 ...

Страница 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...

Страница 85: ...ble 4 3 and to meet the performance targets for Thermal Interface Material in Section 5 3 the Heatsink Static Compressive Load can be assessed using the items listed below HP34970A DAQ Omegadyne load cell 100 lbf max LCKD 100 Test board 0 062 with ILM back plate installed 8 in lbf pneumatic driver Heatsink Gainestown Load Cell Fixture Figure D 1 ...

Страница 86: ...Heatsink Load Metrology 86 Thermal Mechanical Design Guide Figure D 1 Intel Xeon Processor 5500 Series Load Cell Fixture ...

Страница 87: ... offset for thermal characterization parameter Section 5 5 1 3 Reference system configuration In a single wide ATCA blade the 60 W processor should be used in single socket only and the 38 W processor can be used in dual socket 4 Local Ambient Temperature written 50 65o C means 50o C under Nominal conditions but 65o C is allowed for Short Term NEBS excursions 5 Passive heatsinks with TIM 6 See Sec...

Страница 88: ...t offer a NEBS compliant thermal profile are specified in the Intel Xeon Processor 5500 Series Datasheet Volume 1 NEBS thermal profiles help relieve thermal constraints for Short Term NEBS conditions To help reliability processors must meet the nominal thermal profile under standard operating conditions and can only rise up to the Short Term spec for NEBS excursions see Figure E 2 The definition o...

Страница 89: ... systems and UP ATCA configurations with custom thermal solutions In order to cool this part in a single wide ATCA slot a custom thermal solution will be required Since solutions like this will be very configuration specific this heat sink was not fully designed with retention and keep out definitions In order to cool the additional power of a 60W processor in ATCA the heat sink volume was increas...

Страница 90: ...olutions 90 Thermal Mechanical Design Guide Notes Thermal sample only retention not production ready Notes Heat sink should be optimized for the layout Figure E 3 UP ATCA Thermal Solution Figure E 4 UP ATCA System Layout ...

Страница 91: ...Thermal Mechanical Design Guide 91 Embedded Thermal Solutions Figure E 5 UP ATCA Heat Sink Drawing ...

Страница 92: ...Component Suppliers Assembly Component Description Supplier PN Supplier Contact Info Assembly Heat Sink Nehalem EP ATCA ATCA Reference heatsink Intel P N E65918 001 ATCA Copper Fin Copper Base Fujikura HSA 7901 Fujikura America Ash Ooe a_ooe fujikura com 408 748 6991 Fujikura Taiwan Branch Yao Hsien Huang yeohsien fujikuratw com tw 886 2 8788 4959 Table E 3 Mechanical Drawings List Parameter Value...

Страница 93: ...Thermal Mechanical Design Guide 93 Embedded Thermal Solutions Figure E 6 ATCA Reference Heat Sink Assembly Sheet 1 of 2 ...

Страница 94: ...Embedded Thermal Solutions 94 Thermal Mechanical Design Guide Figure E 7 ATCA Reference Heat Sink Assembly Sheet 2 of 2 ...

Страница 95: ...Thermal Mechanical Design Guide 95 Embedded Thermal Solutions Figure E 8 ATCA Reference Heatsink Fin and Base Sheet 1 of 2 ...

Страница 96: ...Embedded Thermal Solutions 96 Thermal Mechanical Design Guide Figure E 9 ATCA Reference Heatsink Fin and Base Sheet 2 of 2 ...

Страница 97: ...lation Tool F Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal Contact the supplier for availability Billy Hsieh billy hsieh tycoelectronics com 81 44 844 8292 ...

Страница 98: ...Processor Installation Tool 98 Thermal Mechanical Design Guide Figure F 1 Processor Installation Tool ...

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