Thermal/Mechanical Design Guide
21
Independent Loading Mechanism (ILM)
3
Independent Loading
Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
1366-LGA land package onto the socket contacts. The ILM is physically separate from
the socket body. The assembly of the ILM to the board is expected to occur after wave
solder. The exact assembly location is dependent on manufacturing preference and test
flow.
Note:
The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts and distribute the resulting compressive load evenly through the socket
solder joints.
Note:
The mechanical design of the ILM is integral to the overall functionality of the LGA1366
socket. Intel performs detailed studies on integration of processor package, socket and
ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be “build to print” from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's
detailed studies and may not incorporate critical design parameters.
3.1
Design Concept
The ILM consists of two assemblies that will be procured as a set from the enabled
vendors. These two components are ILM cover assembly and back plate.
3.1.1
ILM Cover Assembly Design Overview
The ILM Cover assembly consists of four major pieces: load lever, load plate, frame and
the captive fasteners.
The load lever and load plate are stainless steel. The frame and fasteners are high
carbon steel with appropriate plating. The fasteners are fabricated from a high carbon
steel. The frame provides the hinge locations for the load lever and load plate.
The cover assembly design ensures that once assembled to the back plate and the load
lever is closed, the only features touching the board are the captive fasteners. The
nominal gap of the frame to the board is ~1 mm when the load plate is closed on the
empty socket or when closed on the processor package.
When closed, the load plate applies two point loads onto the IHS at the “dimpled”
features shown in
Figure 3-1
. The reaction force from closing the load plate is
transmitted to the frame and through the captive fasteners to the back plate. Some of
the load is passed through the socket body to the board inducing a slight compression
on the solder joints.
Содержание Xeon 5500 Series
Страница 8: ...8 Thermal Mechanical Design Guide ...
Страница 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Страница 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Страница 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Страница 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Страница 56: ...Mechanical Drawings 56 Thermal Mechanical Design Guide Figure B 5 1U Reference Heatsink Assembly Sheet 1 of 2 ...
Страница 57: ...Thermal Mechanical Design Guide 57 Mechanical Drawings Figure B 6 1U Reference Heatsink Assembly Sheet 2 of 2 ...
Страница 61: ...Thermal Mechanical Design Guide 61 Mechanical Drawings Figure B 10 Heatsink Compression Spring 1U 2U and Tower ...
Страница 62: ...Mechanical Drawings 62 Thermal Mechanical Design Guide Figure B 11 Heatsink Retaining Ring 1U 2U and Tower ...
Страница 63: ...Thermal Mechanical Design Guide 63 Mechanical Drawings Figure B 12 Heatsink Load Cup 1U 2U and Tower ...
Страница 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Страница 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
Страница 91: ...Thermal Mechanical Design Guide 91 Embedded Thermal Solutions Figure E 5 UP ATCA Heat Sink Drawing ...
Страница 98: ...Processor Installation Tool 98 Thermal Mechanical Design Guide Figure F 1 Processor Installation Tool ...
