SPSH4 Server SystemTechnical Product Specification
Revision 1.11
Intel reference number 10736
51
6. SCSI Bay Boardset
This chapter provides an overview of the LVD/SE SCSI boardset, describing the architecture of
backplane boardset, and physical board layout diagrams.
The SCSI boardset consists of hot swap backplane and a SAF-TE board. The hot swap
backplane supports the following features:
•
SE SCSI and LVD SCSI modes
•
Five 1 inch LVD/SE SCSI drives per board
•
Single connector attachment (SCA-2) connectors to simplify insertion and removal of hard
disk drives
•
Insertion and removal of hard drives in any power or SCSI bus state (Hot Swap)
•
FET power control for each hard drive
•
FET short protection
•
SCSI-2 SPI-2 (Ultra SCSI and Ultra2 SCSI) and SCSI-2 (Fast-10)
•
SCSI-3 SPI-3 (Ultra-160 SCSI)
•
SCSI-4 SPI-4 (Ultra-320 SCSI)
•
Support for two backplanes on SCSI bus via “Y” cable
•
Drive fault and drive activity LEDs for each disk drive
In addition, a SAF-TE addin card contributes the following features:
•
Microcontroller to monitor enclosure services
•
I
2
C bus for management information
•
Flash memory for upgrading firmware
•
Thermal friendly mechanical form factor
•
SAF-TE compliant
•
Two-fan tachometer monitoring
6.1 Hot Swap Hard Drive Backplane
The backplane is a LVD/SE SCSI design that provides support for SCSI devices using Low
Voltage Differential Signaling (Ultra-160 Ultra-320) as well as older SE SCSI devices (Ultra-160
and older). The backplane has a connector to accommodate a SAF-TE controller on an add-in
card. The backplane supports five 1” hot swapping SCA-2 style drives when mounted in the
docking drive carrier. By using a “Y” cable, two of these backplane assemblies may be
connected for a total of ten SCSI drives off one SCSI channel.
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