Intel S2600IP, Технические характеристики продукции

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Functional Architecture Intel® Server Board S2600IP and Intel® Workstation Board W2600CR TPS
28 Revision 1.1
Intel order number G34153-003
Table 4. RDIMM Support Guidelines
Ranks Per
DIMM and
Data Width
Memory Capacity Per
DIMM
1
Speed (MT/s) and Voltage Validated by
Slot per Channel (SPC) and DIMM Per Channel (DPC)
2
2 Slots per Channel
1DPC 2DPC
1.35V 1.5V 1.35V 1.5V
SRx8
1GB 2GB 4GB 1066 1333 1066 1333 1600
1066 1333
1066 1333 1600
DRx8 2GB 4GB 8GB 1066 1333 1066 1333 1600 1066 1333 1066 1333 1600
SRx4 2GB 4GB 8GB 1066 1333 1066 1333 1600 1066 1333 1066 1333 1600
DRx4
4GB 8GB 16GB 1066 1333 1066 1333 1600
1066 1333
1066 1333 1600
QRx4 8GB 16GB 32GB 800 1066 800 800
QRx8
4GB 8GB 16GB 800
1066
800 800
Notes :
1. Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated by Intel
®
.
2. Command Address Timing is 1N.
3. QR RDIMM are supported but only validated by Intel/PMO in a homogenous environment. The coverage will
have limited system level testing, no signal integrity testing, and no interoperability testing the passing QR
RDIMMs will be web posted.
Supported and Validated
Supported but not Validate
Supported w/Limited Validation
4
Table 5. LRDIMM Support Guidelines
Ranks
Per
DIMM
and
Data
Width
1
Memory
Capacity Per
DIMM
2
Speed (MT/s) and Voltage Validated by
Slot per Channel (SPC) and DIMM Per Channel (DPC)
3,4
2 Slots per Channel
1DPC and 2DPC
1.35V 1.5V
QRx4
(DDP)
5
16GB 32GB 1066 1066, 1333
QRx8
(P)
5
8GB 16GB 1066 1066, 1333
Notes :
1. Physical Rank is used to calculate DIMM Capacity.
2. Supported and validated DRAM Densities are 2Gb and 4Gb.
3. Command Address Timing is 1N.
4. The speeds are estimated targets and will be verified through simulation.
5. DDP - Dual Die Package DRAM stacking. P
– Planer monolithic DRAM Die.
Supported and Validated