Intel® Server Board S2600IP and Intel® Workstation Board W2600CR TPSDesign and Environmental Specifications
Revision 1.1
111
Intel order number G34153-003
9. Design and Environmental Specifications
9.1 Products Design Specifications
The following table defines the Intel
®
Server Board S2600IP and Intel
®
Workstation Board
W2600CR operating and non-operating environmental limits. Operation of the Intel
®
Server
Board S2600IP and Intel
®
Workstation Board W2600CR at conditions beyond those shown in
the following table may cause permanent damage to the system. Exposure to absolute
maximum rating conditions for extended periods may affect system reliability.
Table 59. Server Board Design Specifications
Operating Temperature
0º C to 55º C
1
(32º F to 131º F)
Non-Operating Temperature
-40º C to 70º C (-40º F to 158º F)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
Trapezoidal,
35g
, 170 inches/sec
Shock (Packaged)
< 20 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Note
:
1.
Intel Corporation server boards contain a number of high-density VLSI and power delivery components
that need adequate airflow to cool. Intel ensures through its own chassis development and testing that
when Intel
®
server building blocks are used together, the fully integrated system will meet the intended
thermal requirements of these components. It is the responsibility of the system integrator who
chooses not to use Intel
®
developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of airflow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
Disclaimer Note
: Intel
®
ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible, if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
9.2 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 30
C (ambient air). These
values are derived using a historical failure rate and multiplied by factors for application,
electrical and/or thermal stress and for device maturity. You should view MTBF estimates as
“reference numbers” only.
Calculation Model: Telcordia* Issue 2, method I case 3
Operating Temperature: Server in 30°C ambient air
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