Intel Pentium M 715, Техническое описание

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Datasheet 47
Package Mechanical Specifications and Pin Information
4
Package Mechanical
Specifications and Pin Information
The Pentium M Processor is available in 478-pin, Micro-FCPGA and 479-ball, Micro-FCBGA
packages. Different views of the Micro-FCPGA package are shown in
Figure 4-1 through
Figure 4-3 . Package dimensions are shown in Table 4-1 . Different views of the Micro-FCBGA
package are shown in Figure 4-4 through Figure 4-6 . Package dimensions are shown in Table 4-2 .
The Micro-FCBGA package may have capacitors placed in the area surrounding the die. Because
the die-side capacitors are electrically conductive, and only slightly shorter than the die height, care
should be taken to avoid contacting the capacitors with electrically conductive materials. Doing so
may short the capacitors, and possibly damage the device or render it inactive. The use of an
insulating material between the capacitors and any thermal solution should be considered to
prevent capacitor shorting.
NOTE: All dimensions in millimeters. Values shown for reference only. Refer to Table 4-1 for details.
Figure 4-1. Micro-FCPGA Package Top and Bottom Isometric Views
TOP VIEW BOTTOM VIEW
LABEL
PACKAGE KEEPOUT
DIE
CAPACITOR AREA