50
Datasheet
Package Mechanical Specifications and Pin Information
NOTE:
Overall height with socket is based on design dimensions of the Micro-FCPGA package with no thermal
solution attached. Values are based on design specifications and tolerances. This dimension is subject
to change based on socket design, OEM motherboard design or OEM SMT process.
Table 4-1. Micro-FCPGA Package Dimensions
Symbol
Parameter
Min
Max
Unit
A
Overall height, top of die to package seating plane
1.88
2.02
mm
–
Overall height, top of die to PCB surface, including
socket (Refer to Note 1)
4.74
5.16
mm
A1
Pin length
1.95
2.11
mm
A2
Die height
0.820
mm
A3
Pin-side capacitor height
–
1.25
mm
B
Pin diameter
0.28
0.36
mm
D
Package substrate length
34.9
35.1
mm
E
Package substrate width
34.9
35.1
mm
D1
Die length
12.54
mm
E1
Die width
6.99
mm
e
Pin Pitch
1.27
mm
K
Package edge keep-out
5
mm
K1
Package corner keep-out
7
mm
K3
Pin-side capacitor boundary
14
mm
N
Pin count
478
each
Pdie
Allowable pressure on the die for thermal solution
–
689
kPa
W
Package weight
4.5
g
Package Surface Flatness
0.286
mm
