Datasheet
53
Package Mechanical Specifications and Pin Information
NOTE:
Overall height as delivered. Values are based on design specifications and tolerances. This dimension
is subject to change based on OEM motherboard design or OEM SMT process.
Table 4-2. Micro-FCBGA Package Dimensions
Symbol
Parameter
Min
Max
Unit
A
Overall height, as delivered (Refer to Note 1)
2.60
2.85
mm
A2
Die height
0.82
mm
b
Ball diameter
0.78
mm
D
Package substrate length
34.9
35.1
mm
E
Package substrate width
34.9
35.1
mm
D1
Die length
12.54
mm
E1
Die width
6.99
mm
e
Ball Pitch
1.27
mm
K
Package edge keep-out
5
mm
K1
Package corner keep-out
7
mm
K2
Die-side capacitor height
–
0.7
mm
S
Package edge to first ball center
1.625
mm
N
Ball count
479
each
–
Solder ball coplanarity
0.2
mm
Pdie
Allowable pressure on the die for thermal solution
–
689
kPa
W
Package weight
4.5
g
