Intel Pentium M 715, Техническое описание

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80 Datasheet
Thermal Specifications and Design Considerations
NOTES:
1. The Thermal Design Power (TDP) specification should be used to design the processor thermal solution. The
TDP is not the maximum theoretical power the processor can dissipate.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents at
higher temperatures and extrapolating the values for the temperature indicated.
3. As measured by the on-die Intel Thermal Monitor. The Intel Thermal Monitor’s automatic mode is used to
indicate that the maximum T
J
has been reached. Refer to Section 5.1 for more details.
4. The Intel Thermal Monitor automatic mode must be enabled for the processor to operate within
specifications.
5. For 733J, CPU Signature = 06D8h.
5.1 Thermal Specifications
5.1.1 Thermal Diode
The Pentium M Processor incorporates two methods of monitoring die temperature, the Intel
Thermal Monitor and the thermal diode. The Intel Thermal Monitor (detailed in
Section 5.1 ) must
be used to determine when the maximum specified processor junction temperature has been
reached. The second method, the thermal diode, can be read by an off-die analog/digital converter
(a thermal sensor) located on the motherboard, or a stand-alone measurement kit. The thermal
diode may be used to monitor the die temperature of the processor for thermal management or
instrumentation purposes but cannot be used to indicate that the maximum T
J
of the processor has
been reached. When using the thermal diode, a temperature offset value must be read from a
processor Model Specific register (MSR) and applied. See
Section 5.1.2 for more details. Please
see Section 5.1.3 for thermal diode usage recommendation when the PROCHOT# signal is not
asserted. Table 5-2 and Table 5-3 provide the diode interface and specifications.
Note: The reading of the external thermal sensor (on the motherboard) connected to the processor
thermal diode signals, will not necessarily reflect the temperature of the hottest location on the die.
This is due to inaccuracies in the external thermal sensor, on-die temperature gradients between the
location of the thermal diode and the hottest location on the die, and time based variations in the die
temperature measurement. Time-based variations can occur when the sampling rate of the thermal
diode (by the thermal sensor) is slower than the rate at which the T
J
temperature can change.
Offset between the thermal diode based temperature reading and the Intel Thermal Monitor reading
may be characterized using the Intel Thermal Monitor’s Automatic mode activation of thermal
control circuit. This temperature offset must be taken into account when using the processor
thermal diode to implement power management events.
Symbol
Processor
Number
Parameter Min Typ Max Unit Notes
P
DPRSL
P2
765/755/745/
735/725/715 &
778/758/738 Deeper Sleep Power
@ 0.726V 0.7 W At 35 °C, Note 2
753/733J/733/
723 Deeper Sleep Power
(ULV only)@ 0.726 0.4 W At 35 °C, Note 2, 5
T
J
Junction
Temperature 0 100
°
C Notes 3, 4
Table 5-1. Power Specifications for the Intel
®
Pentium M Processor (Sheet 3 of 3)