Intel Pentium M 715, Техническое описание

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Datasheet 3
Contents
1 Introduction .................................................................................................................................... 7
1.1 Terminology .......................................................................................................................... 9
1.2 References ........................................................................................................................... 9
2 Low Power Features .................................................................................................................... 11
2.1 Clock Control and Low Power States ................................................................................. 11
2.1.1
Normal State .......................................................................................................... 11
2.1.2 AutoHALT Power-Down State ............................................................................... 11
2.1.3 Stop-Grant State .................................................................................................... 12
2.1.4 HALT/Grant Snoop State ....................................................................................... 12
2.1.5 Sleep State ............................................................................................................ 13
2.1.6 Deep Sleep State................................................................................................... 13
2.1.7 Deeper Sleep State ............................................................................................... 14
2.2 Enhanced Intel SpeedStep
®
Technology ........................................................................... 14
2.3 Front Side Bus Low Power Enhancements ........................................................................ 15
2.4 Processor Power Status Indicator (PSI#) Signal ................................................................ 15
3 Electrical Specifications ............................................................................................................. 17
3.1 Power and Ground Pins...................................................................................................... 17
3.1.1
FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 17
3.2 Voltage Identification .......................................................................................................... 17
3.3 Catastrophic Thermal Protection ........................................................................................ 18
3.4 Signal Terminations and Unused Pins................................................................................ 19
3.5 FSB Frequency Select Signals (BSEL[1:0]) ....................................................................... 19
3.6 FSB Signal Groups ............................................................................................................. 19
3.7 CMOS Signals .................................................................................................................... 20
3.8 Maximum Ratings ............................................................................................................... 21
3.9 Processor DC Specifications .............................................................................................. 21
4 Package Mechanical Specifications and Pin Information ....................................................... 47
4.1 Processor Pinout and Pin List............................................................................................. 54
4.2 Alphabetical Signals Reference .......................................................................................... 70
5 Thermal Specifications and Design Considerations ................................................................ 77
5.1 Thermal Specifications ....................................................................................................... 80
5.1.1
Thermal Diode ....................................................................................................... 80
5.1.2 Thermal Diode Offset............................................................................................. 81
5.1.3 Intel
®
Thermal Monitor........................................................................................... 82