Intel
®
Pentium
®
III Processor in the FC-PGA2 Package Thermal Design Guidelines
R
26
249660-001
7.3.2.
Local-ambient Temperature Measurement for an Active
Heatsink
•
During system thermal testing, a minimum of two thermocouples should be placed approximately
0.5 to 1.0 inches (12.7 to 25.4 mm) above the fan inlet as shown in Figure 7-3. The two
thermocouples should be placed 1.0 to 2.0 (25.4 to 50.8 mm) inches apart. This placement
guideline is meant to minimize localized hot spots due to the processor, heatsink, or other system
components.
•
The thermocouples should be centered relative to the fan and heatsink (see top view in Figure 7-3).
•
T
LA
should be the average of the thermocouple measurements during system thermal testing.
Figure 7-3. Local-ambient Thermocouple Measurement Locations (Active Heatsink)
Note:
Figure is not to scale. Locations are approximate and may vary depending on your system configuration.
7.4.
Processor Measurements for Thermal Specifications
Temperature measurements must be made to accurately determine processor thermal performance.
Guidelines have been established for proper techniques for measuring processor temperatures. The
following sections describe these guidelines for temperature measurement.
