Intel
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Pentium
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III Processor in the FC-PGA2 Package Thermal Design Guidelines
R
4
249660-001
8.
Conclusion ..................................................................................................................................33
Figures
Figure 3-1. FC-PGA2 Mechanical Specifications .....................................................................11
Figure 5-1. Example of Air Exchange Through a µATX PC Chassis .......................................15
Figure 7-1. Processor-Heatsink Thermal Resistance Relationships ........................................23
Figure 7-2. Local-ambient Thermocouple Measurement Locations (Passive Heatsink)..........25
Figure 7-3. Local-ambient Thermocouple Measurement Locations (Active Heatsink).............26
Figure 7-4. Locating Geometric Center of Processor...............................................................28
Figure 7-5. Thermocouple Preparation.....................................................................................28
Figure 7-6. Thermocouple Adhesive Placement ......................................................................29
Figure 7-7. Example of Machined Heatsink with Thermocouple Groove .................................30
Figure 7-8. Example of Dimensioning for Thermocouple Groove ............................................31
Tables
Table 3-1. FC-PGA2 Processor Package Dimensions.............................................................12
Table 7-1. List of Items for Thermocouple Attach ....................................................................27
Equations
Equation 1. Case to Ambient Thermal Resistance...................................................................23
Equation 2. Case to Ambient Thermal Resistance...................................................................24
